It's happy to share a newly shipped PCB with you.This high frequency PCB is base on the RT duroid 6002 substrates. This advanced laminate offers exceptional electrical and mechanical properties, making it the ideal choice for complex, multilayer board constructions.

Features:
- Dielectric constant (Dk) of 2.94 ± 0.04 for consistent high-frequency performance
- Ultra-low dissipation factor of 0.0012 at 10 GHz, delivering minimal signal loss
- Thermal coefficient of Dk as low as 12 ppm/°C, ensuring stability across temperature changes
- Thermal conductivity of 0.6 W/m/K and low Z-axis CTE of 24 ppm/°C for reliable performance
- Moisture absorption of only 0.02% for exceptional dimensional stability
- Excellent mechanical properties and high Tg of 500°C for robust, long-lasting circuits

Benefits:
- Optimized for superior high-frequency performance in demanding applications
- Tight thickness control and in-plane CTE matched to copper enable reliable multi-layer designs
- Low outgassing makes it ideal for space and other sensitive environments
- Exceptional dimensional stability ensures consistent electrical characteristics
- Robust construction suitable for a wide range of mission-critical microwave and RF systems

This 2-layer, 0.8mm thick PCB features 35μm copper layers, 0.3mm minimum hole size, and an immersion gold surface finish. Designed to IPC-Class-2 standards, this PCB is extensively tested to ensure 100% electrical integrity prior to shipment.

Unlock the full potential of your high-frequency designs with the Rogers RT/duroid 6002 PCB. Available worldwide, this advanced laminate is ideal for applications such as phased array antennas, radar systems, GPS antennas, and beam-forming networks.

Unlocking the Power of High-Frequency Application with Rogers RT/duroid 6002 PCBs

In the ever-evolving world of microwave and RF electronics, the demand for high-performance, reliable, and thermally stable circuit materials has never been greater. As technologies continue to push the boundaries of frequency, power, and complexity, the choice of printed circuit board (PCB) substrate becomes a critical factor in ensuring optimal system performance. Enter the Rogers RT/duroid 6002, a ceramic-filled PTFE laminate that has emerged as a game-changer in the high-frequency design landscape.

Dielectric Perfection
At the heart of the RT/duroid 6002's exceptional capabilities lies its dielectric properties. With a dielectric constant (Dk) of 2.94 ± 0.04, this material offers remarkable consistency and precision, which is essential for maintaining signal integrity in complex, high-frequency circuits. This tight Dk control translates to improved impedance matching, reduced reflections, and enhanced overall circuit performance.

Equally impressive is the RT/duroid 6002's ultra-low dissipation factor (Df) of 0.0012 at 10 GHz. This exceptionally low loss tangent ensures that signal energy is efficiently transmitted through the circuit, minimizing power dissipation and heat generation. This attribute is particularly crucial in applications that demand high-power handling or strict thermal management requirements.

Thermal Stability and Reliability
The thermal characteristics of the RT/duroid 6002 further set it apart as a premier choice for high-frequency design. With a low thermal coefficient of Dk (12 ppm/°C), this material maintains its dielectric properties even in the face of temperature fluctuations, providing consistent electrical performance across a wide operating range.

Complementing its thermal stability is the RT/duroid 6002's impressive dimensional stability. Its low Z-axis coefficient of thermal expansion (CTE) of 24 ppm/°C, combined with an in-plane CTE that is closely matched to copper, ensures reliable multi-layer board constructions. This prevents issues such as delamination, warping, and thermal mismatch, which can plague less thermally stable materials.

Mechanical Robustness and Environmental Resilience

Designed for demanding applications, the RT/duroid 6002 boasts exceptional mechanical properties and environmental resilience. With a glass transition temperature (Tg) of 500°C, this laminate can withstand the rigors of high-temperature processing and solder reflow, making it suitable for a wide range of manufacturing techniques.

Moreover, the RT/duroid 6002's low moisture absorption of just 0.02% underscores its ability to maintain dimensional stability and electrical performance in environments with varying humidity levels. This attribute, coupled with its low outgassing characteristics, make the material an ideal choice for space-based and other critical applications where environmental factors can significantly impact circuit reliability.

Unlocking New Possibilities
The exceptional properties of the Rogers RT/duroid 6002 PCB substrate open up a world of possibilities for high-frequency design. Its combination of low loss, thermal stability, and mechanical robustness make it a natural choice for a diverse array of applications, including:

Phased array antennas
Ground-based and airborne radar systems
Global positioning system (GPS) antennas
Power backplanes
Commercial airline collision avoidance systems
Beam-forming networks

By leveraging the RT/duroid 6002's performance advantages, designers can push the boundaries of what's possible in microwave and RF engineering, unlocking new frontiers in system efficiency, reliability, and overall capabilities.

Conclusion
In the dynamic and ever-evolving world of high-frequency electronics, the Rogers RT/duroid 6002 stands out as a true powerhouse. Its unparalleled dielectric properties, thermal stability, and mechanical robustness make it an indispensable choice for designers seeking to create cutting-edge, mission-critical circuits and systems. By harnessing the full potential of this advanced PCB substrate, engineers can unlock new levels of performance, reliability, and innovation, paving the way for the next generation of high-frequency technologies.