Specifications
Brand Name :
SenYan
Model Number :
multilayer pcb
Certification :
ISO14001,ISO13485,ISO9001,IATF16949
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiate
Payment Terms :
L/C, D/A, D/P, T/T
Supply Ability :
100000pcs
Delivery Time :
1-30days
Packaging Details :
PCB: Vacuum Packing / PCBA: ESD Packing
Name :
multilayer pcb
Solder mask :
Green
Silk Screen :
White
Surface Technics: :
HASL-F
Max panel size :
32"×20"(800mm×508mm)
Layer count :
2~18
Type :
Electonic Circuit Board PCB Assembly
Testing :
100%E-Testing,PCB Flying test,AOI,X-RAY,PCBA Funtion test/Electronic test
Description

Multilayer Pcb Professional OEM Android Mobile Phone Pcb Board Manufacturer

PCB Types:
Single layer PCBs, double layer PCBs, multilayer PCBs, high TG FR-4 PCBs, heavy copper PCBs, impedance controlled PCBs, gold finger PCBs, plating gold PCBs, and some other PCBs according to customers' requirements.


Application:
Telecommunication, Power Supply, Computer, Industrial Control, Digital Products, Science and Education instruments, Medical Instruments, GPS Technology, Automobile, Satellite Systems, ect.

PCB board Capability

Items Normal standard Ultimate
Material FR-4;High TG FR-4;CEM-3;CEM-4 Al-base
Layer NO. 1-20 40
Board Size 50mm*50mm-560mm*640mm 35mm*50mm
Board Thickness 0.4mm-4.0mm 0.3mm-6.0mm
Thickness Tolerance ±10% ±7%
Min Hole Size 0.2mm 0.15mm
Copper Thickness 18um-105um 18um-420um
Copper Plating hole 18um-30um 18um-40um
Min Trace Width 0.1mm 0.75mm
Min Space Width 0.1mm 0.75mm
SMD Pitch 0.4mm 0.4mm
BGA Pitch 0.6mm 0.6mm
Min Annular Ring 0.07mm 0.05mm
Register Tolerance 0.05mm 0.025mm
Solder Mask Color green;blue;black;red white; yellow
Peelable Mask 0.3mm 0.5mm
HASL Thickness 2.5um
lead Free HASL 2.5um
Immersion Gold Nickel:47um Au:0.05um Nickel:7um Au:0.2um
OSP Thickness 0.2-2.5um
Outline Tolerance CNC:±0.1mm; V-CUT:±0.1mm; Punching:±0.15mm
Impedance Control ±10% ±7%
Warpage Less than 1% Less than 0.7%
certificate ISO9001;TS16949

PCB Assembly Capability

Quantity Prototype&Low Volume PCB Assembly,from 1 Board to 250, is specialty,or up to 1000
Type of Assembly SMT,Thru-hole, DIP
Solder Type Water Soluble Solder Paste,Leaded and Lead-Free
Components Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Bare Board Size Smallest:0.25*0.25 inches
Largest:20*20 inches
File Formate Bill of Materials
Gerber files
Pick-N-Place file
Types of Service Turn-key,partial turn-key or consignment
Component packaging Cut Tape,Tube,Reels,Loose Parts
Turn Time Same day service to 15 days service
Testing Flying Probe Test,X-ray Inspection AOI Test

CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone

CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone

Inquiry

1. PCB:Pleasep provide gerber file for detail Quote.
2. PCBA:Please provide gerder file and Bom list.
3. COPY PCB/PCBA:Please provide us the details of PCB.Picture and Sample will be better.

Quotation

1. We need to confirm PCB requirements and components.
2. PCB quote will be offered within 24 hours.
3. PCBA quote will be offered within 2 working day.

Advantage
1) We do PCB from double side up to 30-layer Multilayer PCB, HDI jobs.
2) If you have repeat orders from other suppliers, and you want to transfer to Senyan, we can accept FREE OF TOOLING.
3) Except excellent quality and professional service, we also pay every detail for our customers, for example package to use Desiccant packs & moisture indicator in vacuum-sealed pack to protect PCB.
4) Material: We have FR4 TG135/TG158/TG180 normal material in stock, also have FR1/ FR2/ FR3/ CEM1/ CEM3/ ROGERS/ ARLON/ ISOLA.
5) Flexible,quickly feedback for customers always.
6) Quickly offer will be less then 4 hours, Some top urgent inquiry we can offer within 1hour.

We provide one-stop PCB/PCBA customization services. To meet all of customer's PCB/PCBA requirement is Senyan circuit service's goal

1. To offer good quality PCB/PCBA to our customer, we will do many kind of testing to ensure quality before shipment

2. Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist testing, Bow testing

3. Micro section testing to check hole Cu thickness, Surface Copper thickness, Wrap copper thickness, Hole Wall Integrity, soldermask thickness and stack up.

4. E-test to check any open/short circuit.

5. Thermal Stress Test to avoid any Delamination, Measling and others.

6. Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Solermask peel off, and soldermask filled in hole-wall incompletely.

Impedance testing, and so on……

Please feel free to contact with us!

FAQ

Q: What does Senyan need for a customized PCB order?

A: When you place a PCB order, the customers need to provide Gerber or pcb file.If you do not have the file in the correct format,

Q: What is your quotation policy?

A: For the PCB order in large quantity, Senyan will send you the quotation based on the MOQ of the products concerned, and the price will be reasonable with good quality.

Q: What does Senyan need for other services?

A: For PCB clone service, the customer needs to send us the printed circuit board concerned,and also the sharp photos of its front side and the back side.

Q: How about the service Senyan offered to the customers?

A: If you have any questions about our products or company, do not hesitate to send us your inquiry toour customer service representatives, Your satisfaction is our pursuits.

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CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone

Ask Latest Price
Brand Name :
SenYan
Model Number :
multilayer pcb
Certification :
ISO14001,ISO13485,ISO9001,IATF16949
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiate
Contact Supplier
CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone
CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone
CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone
CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone
CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone
CEM3 CEM4 Multi Layer PCB Board OEM Android Mobile Phone

Shenzhen Senyan Circuit Co., Ltd.

Active Member
4 Years
guangdong, shenzhen
Since 2017
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Other
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Active Member
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