■ PCB space savings
■ Improved reliability and EMI performance over discrete magnetics
■ Micro-welding of mag wire to PCB versus soldering
■ Meets or exceeds FCC Part 68, IEEE 802.3, and ANSI X3.263 requirements
■ Supports all appropriate and available PHY Chips and applications
■ Extended Temp -40°C to +85°C available
■ Numerous circuit options available
■ Modular Jacks with Integrated Magnetics
Electrical Specification | Value |
---|---|
Turn Ratio | TX=1CT:1CT RX=1CT:1CT |
Insertion Loss | -1.0dB MAX @ 1-65MHz |
Return Loss | -20dB MIN @ 5-10MHz -16dB MIN @ 10-30MHz -12dB MIN @ 30-60MHz -10dB MIN @ 60-80MHz |
Cross talk | -40dB MIN @ 1-30MHz -35dB MIN @ 30-60MHz -30dB MIN @ 60-100MHz |
Common Mode Rejection | -30dB MIN @ 1-50MHz -20dB MIN @ 50-150MHz |
Hipot | 1500Vrms |
OCL | 350uH MIN @ 100KHz, 100mV, 8mA DC Bias |
Operating Temperature | 0°C TO 70°C |
1. Designed to support applications, such as SOHO(ADSL modems),LAN-on-Motherboard(LOM),hub and Switches.
2. Meets IEEE 802.3 specification
3. Connector Materials:
Housing: Thermoplastic UL94V-0
Contact/Shield: Copper alloy
Shield plating: Nickel
Contact plating: Gold 6 micro-inches min.In contact area.
4. Wave solder tip temperature: 265℃ Max
Wave solder tip temperature time: 5 Sec Max
5. UL Certification: File Number E484635