Description

FastJack ™ 1x1 Tab-Down Common Mode Choke RJ45 , Meeting IEEE 802.3/ af/at

1. Product Type Features:

1) Product Type = Connector
2) Jack Type = RJ45
3) Profile = Standard
4) PCB Mounting Orientation = Side Entry (Right Angle)/Top Entry(Vertical)

2. Mechanical Attachment:
1) Jack Configuration = 1 x 1

3. Electrical Characteristics:
1) Shielded = Yes

4. Termination Related Features:
1) EMI Finger - Bottom = Without
2) Termination Method = Solder

5. Body Related Features:
1) Port Configuration = Single/Multi
2) EMI Fingers -Top and Sides = With/ Without
3) Latch Orientation = Standard - Latch Down
4) PCB Tail Length

6. Contact Related Features:
1) Preloaded = Yes
2) Contact Termination Type = Through Hole/Surface Mount

7. Housing Related Features:
1) Connector Style = Jack

8. Industry Standards:
1) RoHS/ELV Compliance = RoHS compliant, ELV compliant
2) Lead Free Solder Processes = Wave solder capable to 240°C,

Wave solder capable to 260°C, Wave solder capable to 265°C

Reflow-Soldering Optional;
3) RoHS/ELV Compliance History = Always was RoHS compliant

9. Identification Marking:
1) Left LED Color (Position #1) = Green - 250 ohm resistor
2) Right LED Color (Position #2) = Green - 250 ohm resistor

10. Conditions for Usage:
1) Applies To = Printed Circuit Board
2) Environmental Conditions = Office / Premises
3) Operating Temperature (°C ) = 0 - 70/-40 - +85

11.Hipot:

1500Vrms MIN

Applications For Terminal User

Designed to support applications, such as ADSL modems, LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...

Competitive Advantage

18 years production experience,

2600 staff,

100% test

Flexible delivery time

Main Customer

Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......

EMS Application

Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly