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1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
Specifications
Brand Name :
JIMA
Model Number :
EDCU-HC
Certification :
SGS, ISO,Reach, RoHS
Place of Origin :
china
MOQ :
100kg
Price :
negotiation
Payment Terms :
T/T, L/C
Supply Ability :
1000 Ton per month
Delivery Time :
5-15 days
Packaging Details :
wooden carton
Anti oxidation :
180 degree 60 minutes, 180 days 23 degree
Tensile strength :
≥ 160 MPa
Peel strength :
≥ 1 N/mm
Application: :
FCCL,FPC
Length Per Roll :
500 - 5000 Meter
Inter Diameter :
76 Mm，152 Mm， 3 Inch，6 Inch
Description

Grain structure leads to high flexibility 1 OZ electrolytic copper foil for fccl.

Products Specifications introduction.

1> Matte side treated in back/red.

2> Thickness: 1OZ.

3> Width Range: 5-1380 mm,standard width:1290mm.

4> ID: 76 mm,152 mm.

5> Cu Content: Min 99.8%.

VLP ED Copper foil Application:

high-frequency board,Used for multilayer circuit boards,Flexible Copper Clad Laminate.

Very Low profile Copper Foils Features.

Grain structure of copper foil leads to high flexibility,Very Low profile enables to make fine circuit pattern,Good folding endurance and Zinc-free.

Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.

Classification

 Unit Requirement Test Method
Foil Designation / 1 H M 1 IPC-4562A
Nominal thickness / 10um 12um 1/2 OZ (18um) 3/4 OZ(25um) 1 OZ(35um) IPC-4562A
Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10

IPC-TM-650

2.2.12.2
Purity ％ ≥99.8

IPC-TM-650

2.3.15
Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5

IPC-TM-650

2.3.17
Matte side(Rz) um ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5
Tensile Strength R.T.(23℃) Mpa ≥300 ≥300 ≥300 ≥300 ≥300

IPC-TM-650

2.3.18
H.T.(180℃) Mpa ≥200 ≥200 ≥200 ≥200 ≥200
Elongation R.T.(23℃) ％ ≥4 ≥5 ≥6 ≥8 ≥10

IPC-TM-650

2.3.18
H.T.(180℃) ％ ≥5 ≥6 ≥7 ≥8 ≥8
Peel Strength(FR-4) N/mm ≥0.8

IPC-TM-650

2.4.8
Ibs/in ≥4.6
Pinholes&porosity Number No

IPC-TM-650

2.1.2
Anti-oxidization R.T.(23℃) 180days /
H.T.(200℃) 60 Minutes /

Remark:Standard width 1295(±1)mm,MAX width 1370mm,May according to the customer request tailor.We test the peel strength with PI ,please reconfirm with your pp.

Packaging:

RFQ:

Q9.Are the package suitable For export ?

Yes , it is suitable for export.

Q2: What's your delivery time ?

The common delivery time is 5-35 working days. The specific delivery time depends on the items and the quantity of your order.

Q12. Is it the Fumigation carton box?

Yes ,it is .

Product tags

expanded copper foil

,

beryllium copper strip

,

beryllium copper strips
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1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility

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Product Detail
Brand Name :
JIMA
Model Number :
EDCU-HC
Certification :
SGS, ISO,Reach, RoHS
Place of Origin :
china
MOQ :
100kg
Price :
negotiation
Contact Supplier
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility
1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility

JIMA Copper

Verified Supplier
9 Years
shanghai, shanghai
Since 2010
Business Type :
Manufacturer
Main Products :
ED Copper Foil, Rolled Copper Foil, Electrolytic Copper Foil
Total Annual :
20000000-50000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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