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Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards
Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards
Specifications
Brand Name :
JIMA
Model Number :
EDCU-HC
Certification :
SGS, ISO,Reach, RoHS
Place of Origin :
China
MOQ :
200kg
Price :
negotiation
Payment Terms :
T/T, L/C
Supply Ability :
1000 Ton per month
Delivery Time :
5-25days
Packaging Details :
Standard wooden carton
Purity :
99.95%
Thickness :
70um,35um
Color :
red or black
Standard :
IPC-4562
Inter Diameter :
76 Mm，152 Mm， 3 Inch，6 Inch
products name :
Electrolytic HTE Copper Foil with thickness 35um For PCB laminate Multi-layer printed circuit boards Multi-layer PCB
high temperature elongation copper foil :
120 min (180 °C in Atmosphere)
Description

Electrolytic HTE Copper Foil with thickness 35um For PCB laminate Multi-layer printed circuit boards Multi-layer PCB

Detail Specification:

Single side treatment in red. and single Side Shiny
Thickness: 70um and 35um
Width range: 5-1380mm,and standard width:1290mm,max 1380mm width

high temperature elongation copper foil :120 min (180 °C in Atmosphere)
Internal diameter: 3 inch/6 inch.
Standard :IPC-4562

Classify:

1.(STD-E)- standard electrodeposited copper foil.

2.(HD-E)-high ductility electrodeposited copper foil.

3.(HTE-E)-high temperature elongation electrodeposited copper foil.

Copper foil Application

Application 2>PCB manufacture
3>antenna PCB

4>PCB laminate

5>Multi-layer printed circuit boards/Multi-layer PCB

Features and advantages

1.The thermally stable microstructures with their stable mechanical properties

2. Improve dimensional stability

3.Reduce bulging, warping and nail head formation.

These resist thermal outliers which typically occur during laminates.


HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 18 25 35 70

IPC 4562

4.6.3.1
Area weight g/m² 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2
Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9
(RZ) μm <8.0 <9.0 ≤10.0 <15

Copper≧

 % 99.8

IPC 4562

4.6.3.1
Tensile Strength state normal Mpa >300 >300 >300 >280

IPC 4562

4.6.4
state temper (180℃) Mpa >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3
state temper (180℃) % >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

 No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1290(±1)mm,May according to the customer request tailor.

Package detail:wooden box

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

RFQ:
Q1: What's your guarantee?
A: All our products have 6 months guarantee after received goods, if any quality problem can contact us.
Q2: What's your delivery time ?
A: The common delivery time is 5-25working days. depend on your order quanity
Q4: Can you supply the sample?
A: Yes,We can
Q5. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
Q6. Can you cut into size as request?
Yes, we can.
Q9. Can we come to China visit factory ?
Yes ,you can .
Product tags

copper sheet for pcb

,

pcb copper foil characteristics

,

copper clad laminate pcb
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Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

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Product Detail
Brand Name :
JIMA
Model Number :
EDCU-HC
Certification :
SGS, ISO,Reach, RoHS
Place of Origin :
China
MOQ :
200kg
Price :
negotiation
Contact Supplier
Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

JIMA Copper

Verified Supplier
9 Years
shanghai, shanghai
Since 2010
Business Type :
Manufacturer
Main Products :
ED Copper Foil, Rolled Copper Foil, Electrolytic Copper Foil
Total Annual :
20000000-50000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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