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18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates
18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates
Specifications
Brand Name :
JIMA
Model Number :
EDCU
Certification :
SGS, ISO,Reach, RoHS
Place of Origin :
china
MOQ :
10kg
Price :
Negotiation
Payment Terms :
T/T, L/C
Supply Ability :
1000 Ton per month
Delivery Time :
5-15 days
Packaging Details :
wooden carton
Products name :
18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates
Application :
1、High Density Interconect(HDI) 2、(High speed digital) 3、Production of high-frequency and high-speed copper clad laminates, 4、communication electronic equipment (Base station / Server routers, switches), 5、computer hardware, 6、 PCB board manufacturing,
sample :
A4 size free
core ID :
76mm,152mm
Lead time :
10-15day
Width :
300mm 500mm 600mm
Description

18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates

JIMA Copper is doing copper foil of Li-ion battery 4.5um to 14um more than 12 years. and production capacity 150000tons /years.

Features:

1,Special silane treatment with high peel strength

2,Nanoscale treatment of copper nodules

3,Excellent anti-oxidation and shelf life

4,Enhanced Bonding Strength

5,Smooth Surface Finish,High Electrical Conductivity

6,Improved Flexibility,Resistance to Corrosion

7,Diverse Thickness and Width Options

8,It has better etching performance. It can effectively shorten the production process, achieve higher speed and fast micro-

etching, and improve the qualification rate of printed circuit boards.

Application:

1,High Density Interconect(HDI)

2,High speed digital

3,Production of high-frequency and high-speed copper clad laminates

4,Communication electronic equipment (Base station / Server routers, switches)

5,Computer hardware

6, PCB board manufacturing

7, Semiconductor industry

8, Electromagnetic shielding and heat conduction

9,Multilayer board；high-frequency board


Details Package: wooden box

FAQ:

Q1: delivery time ?

A: The general delivery time is 10~15 working days.


Q2: What's your minimum order quantity?

A: The MOQ is 10kg.

Q3. what is your standard width?

A: 300mm 500mm 600mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.

18μm RTF Reverse Copper Foil Series standard sample digital:

Specifications standard sample(35 μm)
 


Mechanical Properties
 
Ra on matte side Rz
 
<2.5 μm
 
Tensile strength
 
>330 MPa
 
Elongation
 
>5%
 
peel strength(FR4)
 
≥1.5 N/mm(FR4)

18μm RTF Reverse Copper Foil Series Technical Data Sheet:

Project
 
Unit
 
Technical requiremente
 
Thickness
 
μm
 
18
 
35
 
70
 
Unit Area Weight
 
g/m2
 
145±5
 
275±5
 
585±5
 
Roughness 
M side Rz
 
μm
 
≤3.5
 
≤5.0
 
≤8.0
 
S side Rz
 
μm
 
≤3.0
 
≤3.0
 
≤3.0
 


Tensile Strength
 
25℃
 
MPa
 
≥320
 
≥320
 
≥320
 


Elongation
 
25℃
 
%
 
≥5
 
≥8
 
≥8
 


Peel Strength
 
N/mm
 
1.2
 
1.2
 
1.2
 
Antioxidant Capacity
 
-
 
200℃ 40min No oxidation

Remark: accept customization, Standard Width,100-1440(±1)mm,

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18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

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Product Detail
Brand Name :
JIMA
Model Number :
EDCU
Certification :
SGS, ISO,Reach, RoHS
Place of Origin :
china
MOQ :
10kg
Price :
Negotiation
Contact Supplier
18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

JIMA Copper

Verified Supplier
9 Years
shanghai, shanghai
Since 2010
Business Type :
Manufacturer
Main Products :
ED Copper Foil, Rolled Copper Foil, Electrolytic Copper Foil
Total Annual :
20000000-50000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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