PVD Thin Film Deposition System Sputtering And Thermal Evaporating Vacuum Coating Equipment

PVD Thin Film Deposition System, Sputtering and Thermal Evaporating Vacuum Coating Equipment

PVD Thin Film Deposition System contains the deposition sources of Tungsten filament evaporation source and DC magnetron sputter sources (RF sputtering cathodes are for option). This equipment is mostly used to deposit thin films on plastic parts, glass, metal or foils with the depositing materials like: pure metal Al, Cr, Cu, Ag, Au, Ti etc. Evaporation sources generally to obtain high reflective thin films on products surfaces or conductive films, or give a metallic outlook image. Except that, the sputtering sources condense a wide range of semiconductor materials and dielectrics including transparent conductive oxides, etc.

PVD Thin Film Deposition System Configurations:

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10^-6 Torr.

2. Operating Vacuum Pressure: 1.0×10^-4 Torr.

3. Pumping down Time from 1 atm to 1.0×10^-4 Torr≤3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material ( evaporation): Al, Cr, Sn, Ti, SS, Cu… etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

lStructure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber
1.1 Size: Inner Diameter 1600mm

Inner Height 1600mm

1.2 Material: Vacuum Chamber SUS304 (SS41 mild steel for option)

Door and flanges SUS304 (SS41 mild steel for option)

Chamber strengthen structure: SS41 mild steel, with painted finishing surface treatment.

Chamber chassis SS41 mild steel with painted finishing surface treatment.

1.3 Shield: SUS304

1.4 View Window: on chamber door

1.5 Vacuum Chamber Venting Valve, including silencer

1.6 Door SUS304 material

2. Rouhging Vacuum Pumping System

3. High Vacuum Pumping System

4. Electrical Control and Operation System- PLC+ Touch Screen

4.1 Main circuit: None-fuse breaker switch, electromagnetic switch, C/T in series type

4.2 Evaporation Power: 35kVA

4.3 Evaporation Control System

4.4 Operation System: Touch Screen + PLC, recipe control and data logging, Auto shutdown, auto evacuation, auto coating

4.5 Vacuum Pressure Measuring System

Vacuum Gauge: Pirani + Penning gauge

Thermocouple Gauge: 760 Torr ~ 5*10^-4 Torr

4.6 Alarm System: Compressed air pressure , Cooling water flow, Mis-operation

4.7 Power Load Indicator: Voltage indicator and load current indicator

5. Deposition System

5.1 Tungsten filament evaporation source

5.2 Thermal evaporation materials: wires, rings, rods etc.

5.3 Sputter sources (DC/MF power driven)

6. Sub-System

6.1 Air Compressed Valve Control System

6.2 Cooling Water System-Water flow pipe and switch valve system

Learn more about the machine and applications available, please contact us now.