Closed field unbalanced magnetron sputtering deposition system, Unbalanced Magnetron Sputtering Ion Plating

Unbalanced and closed field magnetron processes have all the advantages of planar magnetrons. Additional advantages and disadvantages are:

• Additional ion bombardment resulting in dense, adherent films
• Ion assist and substrate cleaning possible
• Improved tribological, wear and corrosion resistant films
• Amenable to multilayer, superlattice, nanolaminant and nanocomposite films
• Poorer materials usage
• More complex cathode configuration/expense

Unbalanced and closed field magnetron sputtering revolutionized properties achievable by magnetron sputtering processes. As successful with improved thin film tribological, corrosion resistance and optical properties as this technology was, improvements in magnetron technology had just begun. Next Blog we move onto rotating and cylindrical magnetron processes and resulting thin film applications.

--- Above Artical from P E T E R M A R T I N

Royal technology developed high yield and high target utilization sputtering cathodes, especially for rare and expensive metals sputtering: Au Gold, Ta Tantalum, Ag silver metal films deposition. The high uniformity film's deposition system have been serving several industries like Electronics parts, medical instruments components which require high film uniformity, multiple layers deposition.

The RTSP1000 machine is a standardized machine developed by Royal technology. Extensive applied with cutting/forming tools, molds, medical instruments, electronics components, automotive industries.

High target utilization planar sputtering deposition: please CLICK HERE to watch the video

Linear Ion Source Plasma Cleaning and Assisted Deposition: please CLICK HERE to watch video

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.