High Purity Al2O3 99.999% Sapphire Substrate Wafer Carrier DSP SSP
Sapphire Substrate is a high-quality single-crystal substrate carrier made of Al2O3 material with an ultra-low TTV of less than 5 μm. It is available in both C-plane and M-plane orientation, providing excellent parallelism of 3 arcsecs. It is the perfect choice for sapphire windows and sapphire wafer applications. It is perfect for high-end optical, optoelectronic, and semiconductor device applications. With its outstanding performance, Sapphire Substrate is the ideal choice for demanding applications.
ZMSH's Sapphire Substrate is the perfect choice for your wafer-level device needs. Our sapphire wafer has a model number of Sapphire wafer, which is made in China and features a surface orientation of ±0.5°, a clear aperture of >90%, a surface roughness of Ra<0.5nm, a surface quality of single side polished, and a perpendicularity of 3 arc sec. With its superior quality and reliable performance, it is the perfect substrate for your wafer-level device needs.
Parameters | Description |
---|---|
Name | Sapphire Wafer Substrate Carrier |
Material | Al2O3 99.999% |
Substrate Type | Single Crystal |
Size | 1inch 2inch 3inch 4inch 6 Inch 8inch 12inch |
Thickness | 0.1-5mm |
Bow | <20μm |
TTV | <5μm |
Flatness | λ/10@633nm |
Parallelism | 3 Arc Sec |
Clear Aperture | >90% |
Keywords | Sapphire wafer, sapphire windows, C-plane M-plane, wafer fabrication, crystal growth, opto-electronic, substrate carrier, single crystal |
No | Properties | Target | Tolerance | ||||||||||||||||||||||
1 | Diameter | 50.8mm | ± 0.1mm | ||||||||||||||||||||||
2 | Thickness | 430μm | ±15μm | ||||||||||||||||||||||
3 | Surface orientation of C-plane | off C-axis to M0.2° | ± 0.1° | ||||||||||||||||||||||
4 | Primary flat length | 16mm | ±11mm | ||||||||||||||||||||||
5 | Primary flat orientation | A-plane(11-20) | ±0.1° | ||||||||||||||||||||||
6 | Back side Roughness | 0.8~1.2um | |||||||||||||||||||||||
7 | Front side Roughness | <0.3nm | |||||||||||||||||||||||
8 | Wafer edge | R-type | |||||||||||||||||||||||
9 | Total Thickness Variation, TTV | ≤ 10μm(LTV≤5μm,5*5) | |||||||||||||||||||||||
10 | SORI | ≤10μm | |||||||||||||||||||||||
11 | Bow | -10 μm ≤ BOW ≤ 0 | |||||||||||||||||||||||
12 | Laser Mark | N/A | |||||||||||||||||||||||
Package | 25 wafers in one cassette | ||||||||||||||||||||||||
Trace ability | Wafers shall be traceable with respect to cassette number | ||||||||||||||||||||||||
We specialize in providing customized services for ZMSH Sapphire Substrate with high Clear Aperture and Surface Roughness of <0.5nm, and Bow and Warp of <20μm, available in C-plane. A-plane, M-plane, R-plane 2inch,3inch, 4inch 6inch, 8inch 12inch.
The containers are carefully packed in corrugated cardboard boxes for safe shipping. The box is marked with the customer's address, the product name, and the number of containers. The dimensions of the box are also marked on the box.
The shipping company is responsible for delivering the product to its destination. The customer is responsible for any additional fees associated with the shipping.