Silicon wafer Si wafer 8inch N type P type<111><100><110> SSP DSP Prime grade Dummy grade

Product Overview: 8-Inch Prime Grade Silicon Wafer

Silicon wafers are the backbone of the semiconductor industry, serving as the fundamental substrate for integrated circuits, microchips, and various electronic components. The 8-inch (200 mm) Prime Grade Silicon Wafer is a premium product designed to meet the stringent requirements of high-performance applications. These wafers are manufactured using advanced Czochralski (CZ) crystal growth technology, ensuring superior quality and consistency. With a crystal orientation of <100>, single-side polished (SSP) or double-side polished (DSP) surfaces, and P-type doping with boron, these wafers are ideal for use as semiconductor materials in cutting-edge technologies.

1. Material and Manufacturing

1.1 Single-Crystal Silicon

The 8-inch wafer is fabricated from ultra-high-purity single-crystal silicon. The Czochralski (CZ) process is used to grow large single crystals, ensuring excellent uniformity in crystal structure and minimal lattice defects. This process guarantees the wafer's reliability in high-precision electronic applications.

1.2 Prime Grade Quality

Prime grade silicon wafers represent the highest standard of quality in the semiconductor industry. These wafers undergo rigorous testing and strict quality control to ensure their suitability for critical manufacturing processes. Characteristics of prime grade wafers include:

• Extremely low particle contamination.
• Exceptional surface flatness and minimal roughness.
• High resistivity uniformity and defect control.

2. Key Specifications

3. Crystal Orientation: <100>

The <100> crystal orientation is one of the most commonly used orientations in the semiconductor industry due to its isotropic etching properties and uniform mechanical characteristics. This orientation enables the wafer to provide consistent performance during processes such as chemical etching, ion implantation, and oxidation.

4. P-Type Silicon with Boron Dopant

The P-type designation indicates that the wafer is doped with boron, a Group III element that creates "holes" as the majority charge carriers. This doping type is preferred for numerous semiconductor devices, including diodes, bipolar junction transistors (BJTs), and complementary metal-oxide-semiconductor (CMOS) technology.

Key benefits of P-type doping include:

• Stable electrical performance under a wide range of temperatures.
• High compatibility with standard semiconductor manufacturing processes.

5. Surface Finishing: SSP and DSP

5.1 Single-Side Polished (SSP)

• Used for applications where only one surface requires a high degree of smoothness and flatness.
• The unpolished side retains a natural texture, useful for specific handling or bonding needs.
• Commonly applied in MEMS, sensors, and testing wafers.

5.2 Double-Side Polished (DSP)

• Both sides of the wafer are polished to achieve an exceptionally smooth surface with low roughness (Ra < 0.3 nm).
• Essential for high-precision processes like lithography and thin-film deposition.
• Ensures minimal stress and deformation during fabrication, making it suitable for advanced microelectronics.

6. Thermal and Mechanical Properties

The 8-inch wafer demonstrates excellent thermal and mechanical properties, which are critical for the high-temperature processes commonly encountered in semiconductor fabrication:

• High Thermal Stability: Low thermal expansion coefficient ensures dimensional stability during annealing or rapid thermal processes.
• Mechanical Strength: High-quality CZ-grown silicon withstands physical stress during handling and manufacturing.

7. Applications

The 8-inch Prime Grade Silicon Wafer is versatile and serves a wide range of applications in the semiconductor and electronics industries:

7.1 Semiconductor Devices

• CMOS Technology: Forms the base material for most integrated circuits, including processors and memory devices.
• Power Devices: Ideal for manufacturing power transistors, diodes, and IGBTs due to its stable electrical properties.

7.2 MEMS (Micro-Electro-Mechanical Systems)

The precise surface finishing and crystal orientation make this wafer perfect for MEMS devices like accelerometers, gyroscopes, and pressure sensors.

7.3 Photonics and Optoelectronics

The wafer is used in photonic applications such as optical sensors, light-emitting diodes (LEDs), and photovoltaic cells.

7.4 R&D and Prototyping

Its high-quality surface and electrical characteristics make it an excellent choice for research institutions and prototype development.

8. Packaging and Handling

To preserve the wafer's pristine quality, it is packaged under stringent cleanroom conditions:

• Class 100 Environment: Ensures minimal particle contamination during packaging.
• Secure Packaging: The wafers are placed in cassettes (25 wafers per cassette) and sealed in nitrogen-purged bags to prevent oxidation and contamination during transportation.

9. Advantages of 8-Inch Prime Grade Silicon Wafer

9.1 Exceptional Quality

The prime grade classification guarantees unmatched flatness, surface smoothness, and minimal defect density.

9.2 Compatibility with Industry Standards

These wafers conform to international standards such as SEMI M1, ensuring their compatibility with global manufacturing processes.

9.3 Cost-Effective Manufacturing

The 8-inch size strikes a balance between affordability and production volume, making it an industry standard for many years.

9.4 Versatility

The availability of SSP and DSP options ensures that the wafers can be tailored to a wide variety of applications.

10. Customization Options

To meet specific customer needs, the 8-inch Prime Grade Silicon Wafer can be customized in the following ways:

• Resistivity Range: Adjustable to fit the requirements of different devices and processes.
• Thickness Variations: Special thicknesses can be manufactured for unique applications.
• Oxide Layer: Thermal or chemical oxide layers can be added as needed.

11. Conclusion

The 8-inch Prime Grade Silicon Wafer represents the pinnacle of silicon wafer technology, providing unmatched quality, performance, and versatility. Its advanced specifications and robust manufacturing processes make it indispensable in the production of modern semiconductor devices. Whether you’re designing next-generation processors, MEMS devices, or cutting-edge photonics, this wafer ensures the reliability and precision required for success.

By offering both SSP and DSP options, as well as the flexibility to customize resistivity and thickness, these wafers are poised to meet the evolving demands of the semiconductor industry. Their widespread applications in high-tech manufacturing and research solidify their status as a critical component of the global electronics supply chain.