copper substrate Copper cubic Cu wafer/substrate 100 110 111 orientaiton SSP DSP purity 99.99%
copper substrate's brief
Our single crystal copper wafers, with a purity of 99.99%, are engineered to deliver optimal electrical and thermal performance for advanced semiconductor and electronic applications. These wafers are available in different orientations, including <100>, <110>, and <111>, tailored to maximize efficiency in specific use cases. With sizes ranging from 5×5×0.5 mm to 20×20×1 mm, and a lattice constant of 3.607 Å, these copper substrates ensure high precision and structural stability. Both single-side polished (SSP) and double-side polished (DSP) options are available, catering to varied fabrication requirements. The excellent conductivity of copper makes these wafers highly effective for use in electronic interconnections, heat dissipation systems, and microelectronic components. Designed for versatility, they are ideal for a range of applications, from high-power devices to intricate circuitry, providing reliability and excellent performance in demanding environments.
copper substrate's showcase
copper substrate's properties
Copper substrates are renowned for their superior electrical and thermal properties, making them essential in high-performance applications. These substrates exhibit remarkable electrical conductivity, which ensures rapid and efficient energy transfer in electronic systems. With a purity level of 99.99%, copper substrates have minimal impurities, which is vital for maintaining the performance and reliability of advanced devices. The high purity also reduces the likelihood of defects and enhances the structural integrity of electronic components, making them suitable for precision-driven industries such as microelectronics and semiconductors.
The single crystal structure of copper, offered in orientations of <100>, <110>, and <111>, provides high crystallographic uniformity and strength. These orientations are carefully chosen based on the specific application requirements, ensuring that the copper substrate delivers optimal performance. The lattice parameter of 3.607 Å contributes to the precise alignment of atoms, creating a stable foundation for the development of next-generation electronic devices. This atomic precision is crucial in reducing resistance and enhancing the overall performance of copper-based systems.
In addition, copper substrates are available in various polished finishes, including single-side polished (SSP) and double-side polished (DSP). Polished surfaces enhance the interface between the substrate and thin-film materials, reducing scattering losses and improving the efficiency of the manufacturing process. Thanks to their high thermal tolerance and mechanical durability, copper substrates are extensively used in microelectronics, heat dissipation systems, and energy storage technologies, where efficient heat management and reliability are of utmost importance. These properties make copper substrates a key material in many advanced technological applications.
Main Parameters of Copper Single Crystal Substrates | |
Material | Cu |
CAS# | 7440-50-8 |
Purity | 99.999% (5N) |
Crystal structure | Cubic, Fm-3m |
Unit cell constant | a = 3.614 A |
Melt point (ºC) | 1,084.62 |
Density (g/cm3) | 8.96 |
Hardness | 3 Mohs, 343-369 Vickers |
Thermal expansion (x 10-6 K-1 ) | 16.5 |
Thermal Conductivity (W m-1 K-1) | 401 |
Sizes | 5 mm x 5 mm x 1 mm Thick, 10 mm x 10 mm x 0.5 mm Thick |
other sizes are available upon request | |
Surface polishing | Single side polished is standard, Double side polished upon request |
Crystal orientations | (100), (110), (111), +/- 0.5 degree |
Surface roughness, Ra: | ~10nm |
Package | sealed in class 100 clean bags packed in class 1000 clean room |
copper substrate's applications
Copper substrates have several important applications across various industries due to copper's excellent electrical conductivity, thermal conductivity, and mechanical strength. Below are some of the key applications:
Copper's combination of thermal and electrical conductivity makes it ideal for applications requiring heat management and efficient energy transfer. These properties contribute to its widespread use in modern technology.
Q&A
What is the raw material of copper?
Copper concentrate is the fundamental raw material used to make copper. In nature copper can be found in a great many minerals, at a percentage ranging between approximately 0.5% and 10%. Once these minerals have been mined, various processes are applied to increase the copper concentration to 20 to 35%.