Copper substrate single crystal Cu wafer 5x5x0.5/lmm 10x10x0.5/1mm 20x20x0.5/1mm a=3.607A
Copper substrate's abstract
Our copper substrates and wafers are made from high-purity copper (99.99%) with a single crystal structure, offering excellent electrical and thermal conductivity. These wafers are available in cubic orientations of <100>, <110>, and <111>, making them ideal for applications in high-performance electronics and semiconductor manufacturing. With dimensions of 5×5×0.5 mm, 10×10×1 mm, and 20×20×1 mm, our copper substrates are customizable to meet diverse technical needs. The lattice parameter for these single crystal wafers is 3.607 Å, ensuring precise structural integrity for advanced device fabrication. Surface options include single-side polished (SSP) and double-side polished (DSP) finishes, providing flexibility for various manufacturing processes.
These copper wafers are especially suited for microelectronics, thermal management, and interconnection technologies due to their superior conductivity and customizable orientations. Whether for small-scale components or larger systems, our copper substrates deliver the durability and performance required for cutting-edge technological applications.
Copper substrate's photo
copper substrate's properties
Copper substrates are highly regarded for their excellent electrical and thermal conductivity, which make them an ideal material for use in the electronics and semiconductor industries. With a purity level of 99.99%, these substrates have minimal impurities, ensuring high performance and reliability in sensitive applications. The low impurity content is critical for reducing defects in electronic devices, enhancing their lifespan and efficiency. Copper’s intrinsic conductive properties enable faster and more efficient energy transfer, which is crucial for circuits, microchips, and other high-speed electronic components.
The single crystal structure of these substrates, available in <100>, <110>, and <111> orientations, provides uniformity and mechanical stability. This crystalline precision ensures the substrates can support the creation of highly detailed, precise components in semiconductor manufacturing. The lattice constant of 3.607 Å further contributes to this structural consistency, offering an ideal platform for advanced device fabrication.
Additionally, copper substrates are available in both single-side polished (SSP) and double-side polished (DSP) finishes, offering versatility depending on the fabrication requirements. The smooth surface of polished substrates reduces scattering and improves adhesion during the fabrication of microelectronic devices.
With their ability to withstand high thermal loads and offer superior conductivity, copper substrates are widely used in applications such as thermal management, electronic interconnections, and high-performance power devices.
Main Parameters of Copper Single Crystal Substrates | |
Material | Cu |
CAS# | 7440-50-8 |
Purity | 99.999% (5N) |
Crystal structure | Cubic, Fm-3m |
Unit cell constant | a = 3.614 A |
Melt point (ºC) | 1,084.62 |
Density (g/cm3) | 8.96 |
Hardness | 3 Mohs, 343-369 Vickers |
Thermal expansion (x 10-6 K-1 ) | 16.5 |
Thermal Conductivity (W m-1 K-1) | 401 |
Sizes | 5 mm x 5 mm x 1 mm Thick, 10 mm x 10 mm x 0.5 mm Thick |
other sizes are available upon request | |
Surface polishing | Single side polished is standard, Double side polished upon request |
Crystal orientations | (100), (110), (111), +/- 0.5 degree |
Surface roughness, Ra: | ~10nm |
Package | sealed in class 100 clean bags packed in class 1000 clean room |
copper substrate's applications
Copper substrates are widely used across various industries due to their excellent electrical conductivity, thermal conductivity, and mechanical strength. Here are the key applications of copper substrates:
Copper's exceptional thermal and electrical properties make it indispensable in applications requiring high-efficiency energy transfer and effective heat management. These characteristics drive its extensive use in modern technology and high-performance systems.
Q&A
What is copper material?
copper (Cu), chemical element, a reddish, extremely ductile metal of Group 11 (Ib) of the periodic table that is an unusually good conductor of electricity and heat. Copper is found in the free metallic state in nature. This native copper was first used