Si wafer 4inch Polished CZ Dopant Arsenic(As) Boron(B) Phosphorus(Ph) (100) Semiconductor
A Silicon wafer is a very thin round disk cut from high-purity silicon. A round silicon ingot is sliced to thicknesses of approximately 1mm. The surfaces of the resulting disk are polished carefully, then it is cleaned, resulting in the completed wafer. Silicon wafers are made from high-purity silicon and are the material of semiconductor devices. These wafers can also be fabricated with an SEMI notch or one or two SEMI flats. we specialize in producing high-quality polished silicon wafers for semiconductor and electronics applications. Our 100mm polished silicon wafers offer prime quality single crystal monocrystalline material with tightly controlled electrical resistivity and thickness variation specifications. This product consists of 100mm diameter silicon wafers sliced from a single crystal ingot grown using the Czochralski (CZ) method. They have been either single-side polished or double-side polished to achieve exceptional thickness uniformity, particle performance, surface microroughness, and flatness specifications.
The Form of Si Wafer:
Product Name | 4-inch polished wafer |
Material | Silicon |
Diameter | 100±0.2mm |
Thickness | 525±15um / as requested |
Type/Dopant: | P/Boron or N/As |
Resistivity | as request |
Orientation | <100> |
Grade | Prime/Test grade/ Test grade |
Growth | CZ |
Primary Flat Location | <110>±1 |
Primary Flat Length | 32.5±2.5mm |
Thickness Tolerance | 500±20μ m |
TTV | <10μ m |
TIR | <10um |
Warp | <30μ m |
Bow | <30μ m |
Front Surface | Polishing |
Back Surface | Grinding |
Oxidation | Wet Oxidation |
The Physical photo of Si Wafer:
The Application of Si Wafer:
1. Microchip production and integrated circuit fabrication
2. MEMS and microelectromechanical systems
3. Semiconductor and sensor manufacturing
4. LED lighting and laser diode creation
5. Solar/photovoltaic cells and wafers
6. Optical equipment components
7. Insulated sandwich panels
8. R&D prototyping and testing
The Application Pictures of Si Wafer:
We specialize in the processing and supply of various types of high-quality silicon wafers. Our offerings include:
Single Crystal Silicon Wafers Growth Methods: CZ (Czochralski), MCZ, and others.
Sizes: 2", 4", 5", 6", 8" as well as custom diameters and non-standard shaped silicon wafers.
Surface Finishes: Single-side polished, double-side polished, grinding, etc.
Conductivity Types: N-type, P-type, intrinsic semiconductors.
Specifications: Tailored to meet a wide range of applications.
Supply Capacity: Extensive inventory with various types available in stock.
Processing Flexibility: Custom processing of various specifications, tailored to meet customer requirements with short lead times.
1. Q: What surface finishes can we supply?
A: We offer wafers with double-side polish (DSP), single-side polish (SSP), or Etched/Etched surfaces. Please feel free to contact us for your preferred specifications.
2. Q: What customizations are available?
A: Our capabilities include laser marking, wafer labeling, and various edge modifications like cuts or notches to your exact requirements.
3: Q: What sizes do you offer?
A: Besides our 4-inch (100mm) silicon wafers, we also supply sizes of 2”, 3”, 150mm, 200mm, and 300mm diameter. Other custom sizes may be available upon request.
1. Single Crystal Si Wafer Electronic Device Substrate Photolithography Layer 2"3"4"6"8"
2. Silicon Wafer CZ orientation111 Resistivity: 1-10 (ohm. cm) single side or double side polish