Product Overview

This equipment is specifically designed for micro-hole machining of superhard materials, integrating high-precision mechanical systems, intelligent control software, and advanced laser technology. It overcomes the limitations of traditional processes in material adaptability, machining precision, and efficiency. The equipment is suitable for precision drilling, cutting, and micromachining of high-end materials such as diamond, sapphire, ceramics, and aerospace alloys. It assists enterprises in achieving production goals of micron-level aperture, no thermal damage, and high yield rates.

Technical Specifications

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Processing Performance & Quality Assurance

Material Compatibility​

• ​Ultra-Hard Materials: Diamond, cubic boron nitride (CBN), tungsten carbide
• ​High-Melting Metals: Rhenium, tungsten, titanium alloys
• ​Ceramics/Semiconductors: Zirconia, silicon carbide, gallium arsenide
• ​Sapphire (Key Advantage): Supports micro-drilling of sapphire (Al₂O₃) sheets (0.1–5mm thickness), overcoming brittleness issues in traditional machining.
• ​General Metals: Stainless steel, carbon steel, aluminum alloys

​Processing Capabilities​

• ​Hole Range: φ0.1–5mm (customizable for smaller diameters)
  - ​Depth: 0.01–10mm (multi-layer stepped holes supported)
  - ​Taper: 0°–30° adjustable

​Quality Advantages​

• ​Geometric Precision: Hole diameter tolerance ±5%, taper error <0.1°, cylindricity >99.9%
• ​Surface Finish: Ra≤0.8μm (mirror finish), no burrs or melt residue—critical for brittle materials like sapphire.
• ​Stability: Temperature drift <±1μm after 8 hours of continuous operation; yield rate >99.5% (tested on typical materials).

​Breakthrough Technologies​

• ​Ultrashort Pulse Mode​ (optional): Pulse width ≤10ps, heat-affected zone <1μm—ideal for sapphire and other thermally sensitive materials.
• ​Dynamic Parameter Adjustment: Automatically optimizes laser frequency/power based on material hardness, improving sapphire drilling efficiency by 30%.

Typical Applications

Precision Mold & Bearing Manufacturing​

• ​Diamond Drawing Dies: Drilling holes <φ0.05mm to extend tool life by 30%.
• ​Sapphire Bearings:
  • Micro-array drilling for spindle bearings with rotational accuracy ±1μm and enhanced wear resistance.
  • Sterile micro-drilling for medical implant bearings meeting biocompatibility standards.

​Semiconductor & Electronics​

• ​Chip Packaging: BGA pad micro-via drilling with diameter consistency ±2μm.
• ​Sensor Probes: Micro-hole formation in medical catheters with Ra≤0.1μm surface finish.

​New Energy & Aerospace​

• ​Lithium-ion Battery Separators: Micro-porous arrays to increase energy density.
• ​Titanium Alloy Blades: Cooling hole drilling without stress cracks associated with traditional methods.

ZMSH High-Precision Laser Drilling Machine

Common Issues & Solutions