SiC Ingot Cutting Machine for 4, 6, 8, and 10-inch SiC Cutting Speed: 0.3 mm/min (average)
The SiC Wire Saw Cutting Machine by ZMSH is designed for precision cutting of silicon carbide (SiC) materials. It efficiently handles various crystal sizes, offering high cutting speeds and accuracy. This machine is ideal for SiC boule cutting, suitable for 6-inch, 8-inch, and 10-inch SiC crystals. The advanced wire saw technology ensures smooth, high-quality surface finishes and minimizes material wastage. This machine is a key asset for semiconductor manufacturers, particularly in the production of SiC wafers for power devices and other high-tech applications.
Parameter | Value |
---|---|
Crystal Size Range | 4, 6, 8, and 10-inch SiC |
Average Cutting Speed | 0.3 mm/min |
Max. Cutting Force | 0–110N (0.25mm wire with 45N tensile force) |
Tensile Strength of Wire | ≥0.18mm |
Surface Finish | Ra ≤ 0.3μm |
Machine Size (L × W × H) | 2500 × 2300 × 2500 mm |
Machine Power | 50 kW |
Cutting Error Rate | ≤1% (excluding external factors) |
Equipment Weight | ≤5.5t |
Noise Level | ≤80 dB |
At ZMSH, we offer a comprehensive range of services to ensure the seamless operation and performance of our SiC Wire Saw Cutting Machines.