The Wafer Bonder is a versatile solution for advanced semiconductor manufacturing, offering reliable direct bonding, anodic bonding, and thermocompression processes. Designed for high yield and repeatability, it supports 6- to 12-inch wafers with thickness flexibility, ensuring precise alignment and process stability for diverse applications like 3D IC packaging, MEMS devices, and power electronics.
Equipped with automated handling and intelligent monitoring, the system minimizes material waste and maximizes uptime. Its modular design allows quick adaptation to new processes, reducing operational complexity. Compliant with global industry standards, the bonder integrates seamlessly with existing production lines and MES systems, enhancing traceability and efficiency.
Backed by ISO-certified quality and responsive global service, this platform delivers long-term performance while optimizing cost-of-ownership for high-volume manufacturing.
Wafer Bonding Techniques
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ZMSH Wafer Bonder
Frequently Asked Questions (FAQ)
Q: Which bonding method is best for temperature-sensitive materials?
A: Room-temperature bonding or temporary bonding are ideal for materials like polymers or organic electronics, as they avoid thermal stress.
Q: How does temporary bonding work?
A:A reversible adhesive layer (e.g., BCB or UV resin) bonds the wafer to a carrier. After processing, separation is done via laser lift-off or thermal slide.
Q: Can I integrate bonding with existing lithography tools?
A: Yes, modular bonders can be integrated into fabs with MES-compatible controls.