The laser drilling machine are innovative solutions designed to revolutionize glass processing across industries. Engineered with a customized 532nm green laser, these systems deliver unparalleled precision, minimal thermal damage, and exceptional stability. Ideal for display glass, quartz, and semiconductor wafers, we ensures non-contact processing with crack rates as low as 0.1%, making it the gold standard for high-precision applications.
Key Features:
Technical Specifications & Differentiators
Component | Parameter |
Wavelength | 532nm (Green Laser) |
Max Laser Power | 15W/30W |
Max Glass Size | 300mm × 300mm |
Processing Area | 900mm × 600mm |
Accuracy | ≤±0.015mm |
Performance & Quality of Laser Drilling Machine
Unmatched Precision:
Stability & Efficiency:
Minimal Thermal Damage:
Applications
ZMSH Glass Laser Drilling Machine
Frequently Asked Questions (FAQ)
Q: What material compatibility is supported beyond glass?
A: Besides standard soda-lime glass, the system processes quartz, borosilicate glass, and semiconductor-grade silicon wafers (with thermal conductivity ≤150 W/m·K). The green laser’s 532nm wavelength ensures absorption efficiency across these materials without requiring coating or pretreatment.
Q: How is dimensional accuracy maintained for large-format glass (900×600mm)?
A: Equipped with a linear motor-driven Z-axis and real-time collimation feedback, the system compensates for thermal drift and mechanical vibration. A patented dynamic focal length adjustment maintains ±0.015mm accuracy even at the edges of large plates.
Q: What environmental controls are required for optimal performance?
A: The device operates in ambient temperatures of 20±5°C with relative humidity ≤60%. For extreme environments, optional temperature-stabilized enclosures (+/-0.5°C) and dustproofing kits are available to prevent laser beam distortion.