Thickness 650um Dia 100 mm 4 inch Sapphire Substrate Wafer Single Side Polished
Orientation: (22-43)Plane offcut 0.45° away from C plane-per sketch 22-43
Diameter: 100mm ± 0.2mm
Thickness: 650um ± 20um / 850um ± 20um
Bow: <10 microns
Warp: <20 microns
TTV: <10 microns
Major Flat: M-axis +0.3°; 32+1mm
Minor Flat: None
Front Side: < 0.30nm
Back Side: <1.2 microns
Laser ID: marked on backside by major flat
Packaged: Cassette containing 25 wafers(s), Class 100 cleanroom envirnment
Specification
Orientation | (22-43)Plane offcut 0.45° away from C plane-per sketch 22-43 |
Diameter | 100mm ± 0.2mm |
Thickness | 650um ± 20um / 850um ± 20um |
Bow | <10 microns |
Warp | <20 microns |
TTV | <10 microns |
Major Flat | M-axis +0.3°; 32+1mm |
Minor Flat | None |
Front Side | < 0.30nm |
Back Side | <1.2 micron |
Laser ID | marked on backside by major flat |
Packaged | Cassette containing 25 wafers(s), Class 100 cleanroom envirnment |
Customers need to know:
1. The products are made according to the requirements of customers. Please contact us before placing an order to confirm the detailed production process, quantity, production period, logistics and other relevant information.
2. Customization needs to know:
(1) plate Customization: please directly provide dimensions (length * width * thickness, and color quantity) (please consult customer service quotation).
(2) product processing: please send drawings to the owner, such as CDR, AI, CAD and other vector drawings, and inform the thickness, (consult customer service quotation) to give you a quotation. No friends can draw by hand and take photos for us. We need drawings for complex processing.
3. Please confirm the size and drawing carefully before photographing. Once processed, it will not be returned or changed.
4. There is a certain tolerance for processing and material thickness. Buyers who require no difference should be merciful! The tolerance is about 0.3mm. Once photographed, we do not accept any return or exchange due to tolerance!
Process Flow