XC6SLX100-2FGG676C Programmable IC Chip Package 676-FBGA DC and Switching Characteristics
Number of LABs/CLBs | 7911 | |
Number of Logic Elements/Cells | 101261 | |
Total RAM Bits | 4939776 | |
Number of I/O | 480 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | | |
Supplier Device Package | 676-FBGA (27x27) |
Product: XC6SLX100-2FGG676C Programmable IC Chip
Specifications:
- Family: Spartan-6
- Device: XC6SLX100
- Speed Grade: -2
- Package: FGG676
- I/O Pins: 676
- Logic Cells: 101,261
- Slices: 15,850
- Block RAM: 4,860 Kb
- DSP Slices: 180
- Clock Management Tiles: 4
- Total RAM Bits: 4,812,800
- Operating Voltage: 1.0V - 1.2V
- Operating Temperature: -40°C to +100°C
Features:
- High-performance, low-power FPGA (Field-Programmable Gate Array)
- Designed for a wide range of applications
- Supports high-speed communication and processing requirements
- Industry-standard core voltages for efficient power consumption (1.0V - 1.2V)
- Large logic capacity with 101,261 logic cells
- Abundant I/O pins (676) for versatile connectivity options
- Integrated memory blocks (4,860 Kb) for efficient data storage
- DSP resources (180 slices) for digital signal processing
- Advanced clock management tiles (4) for precise timing control
- Wide operating temperature range for various environments
- Supports advanced design methodologies and tool flows
Package Details:
- Package Type: FGG676
- Pin Count: 676
- Pin Pitch: 1.0mm
- Package Dimensions: 27mm x 27mm