XC3S400AN-4FGG400I Programmable Gate Array (FPGA) IC Chip Package 400-BGA

Voltage Supply 1.14V ~ 1.26V

Product Listing: Programmable IC Chip - XC3S400AN-4FGG400I

Product Name: Programmable IC Chip - XC3S400AN-4FGG400I

Product Description: The Programmable IC Chip - XC3S400AN-4FGG400I is a high-performance integrated circuit designed for programmable logic applications. It offers advanced features, reliable performance, and versatile design capabilities to cater to a wide range of electronic projects and applications.

Product Specifications:

• Model: XC3S400AN-4FGG400I
• Package Type: 400-ball Fine-Pitch Ball Grid Array (FGG400)
• Manufacturer: Xilinx
• Operating Temperature: -40°C to 100°C
• Logic Cells: 40,000
• Maximum User I/O Pins: 288
• Block RAM: 1,080 Kbits
• DSP Slices: 48
• Clock Management Tiles: 2
• JTAG Boundary Scan Support: Yes
• Configuration Memory: Non-volatile Flash
• Power Supply Voltage: 1.2V core voltage, 1.8V/2.5V/3.3V I/O voltage

Key Features:

• High-performance programmable logic device
• Fine-Pitch Ball Grid Array (FGG400) package for reliable operation
• Large number of logic cells for complex designs
• Versatile I/O pins for flexible connectivity options
• Abundant block RAM for efficient data storage and processing
• Dedicated DSP slices for advanced digital signal processing
• Clock management tiles for precise timing control
• JTAG boundary scan support for easy debugging and testing
• Non-volatile flash memory for secure and reliable configuration storage
• Wide operating temperature range for diverse environments
• Suitable for a variety of applications requiring programmable logic

Applications:

• FPGA-based system designs
• Embedded systems and IoT devices
• Digital signal processing applications
• Communications and networking devices
• Video and image processing systems
• Industrial automation and control systems
• Test and measurement instruments
• Aerospace and defense systems
• Medical equipment

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