XC7K70T-1FBG676C Programmable IC Chip Package 676-BBGA Voltage - Supply 0.97V ~ 1.03V

Product Listing: Programmable IC Chip - XC7K70T-1FBG676C

Product Name: Programmable IC Chip - XC7K70T-1FBG676C

Product Description: The Programmable IC Chip - XC7K70T-1FBG676C is a high-performance and advanced integrated circuit designed for programmable logic applications. It offers exceptional capabilities and flexibility, making it ideal for demanding electronic projects and systems.

Product Specifications:

• Model: XC7K70T-1FBG676C
• Package Type: 676-pin Fine-Pitch Ball Grid Array (FBG676)
• Manufacturer: Xilinx
• Operating Temperature: -40°C to 100°C
• Logic Cells: 66,240
• Maximum User I/O Pins: 500
• Block RAM: 4,860 Kbits
• DSP Slices: 180
• Clock Management Tiles: 6
• JTAG Boundary Scan Support: Yes
• Configuration Memory: Non-volatile SPI Flash
• Power Supply Voltage: 1.0V core voltage, 2.5V or 3.3V I/O voltage

Key Features:

• High-performance and advanced programmable logic device
• Robust and reliable Fine-Pitch Ball Grid Array (FBG676) package
• Large number of logic cells for complex designs
• High-speed I/O capabilities for demanding applications
• Abundant block RAM for efficient data storage
• Dedicated DSP slices for signal processing tasks
• Clock management tiles for precise timing control
• JTAG boundary scan support for easy debugging and testing
• Non-volatile SPI Flash for configuration storage
• Wide operating temperature range for reliability
• Low power consumption for energy-efficient designs

Applications:

• Data center and cloud infrastructure
• High-performance computing
• Video processing and streaming
• Wireless communication systems
• FPGA prototyping and development
• Image and signal processing
• Industrial automation and control
• Aerospace and defense systems

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