XC6SLX9-2CSG225I Programmable IC Chip Package 225-CSPBGA Automotive and Defense-grade devices
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Product Listing: Programmable IC Chip - XC6SLX9-2CSG225I
Product Name: Programmable IC Chip - XC6SLX9-2CSG225I
Product Description: The Programmable IC Chip - XC6SLX9-2CSG225I is a high-performance and versatile integrated circuit designed for programmable logic applications. With its advanced features and compact form factor, it offers designers the flexibility to create innovative solutions for a wide range of electronic projects and systems.
Product Specifications:
- Model: XC6SLX9-2CSG225I
- Package Type: 225-pin Ceramic Ball Grid Array (CSG225)
- Manufacturer: Xilinx
- Operating Temperature: -40°C to 100°C
- Logic Cells: 9,152
- Maximum User I/O Pins: 125
- Block RAM: 352 Kbits
- DSP Slices: 16
- Clock Management Tiles: 1
- JTAG Boundary Scan Support: Yes
- Configuration Memory: Non-volatile SPI Flash
- Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage
Key Features:
- High-performance and compact programmable logic device
- Durable and reliable Ceramic Ball Grid Array (CSG225) package
- Efficient utilization of logic cells for various designs
- Adequate I/O pins for connectivity requirements
- Ample block RAM for data storage needs
- Dedicated DSP slices for signal processing tasks
- Clock management tiles for precise timing control
- JTAG boundary scan support for easy debugging and testing
- Non-volatile SPI Flash for configuration storage
- Wide operating temperature range for reliability
- Low power consumption for energy-efficient designs
Applications:
- Embedded systems and IoT devices
- Communication and networking equipment
- Industrial automation and control systems
- Consumer electronics and multimedia devices
- Medical equipment and instrumentation
- Automotive electronics
- Aerospace and defense systems
- Test and measurement instruments
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