Big Size Hot Air Reflow Oven With 12 Heating Zones PCB Soldering Machine

Reflow Oven Features:

1. Reflow Oven is optimized design and advanced technology, excellent and precise manufacturing;
2. Advanced technology application and creation to reassure the best machine performance;
3. Adhering to the rigorous and pragmatic tradition of equipment manufacturing, the machine is durable with good reputation and low failure rate;

4. The most efficient heating and conduction, allows ΔT control inside the chamber to be ±1℃

5. The exclusive patented flux collection system makes the chamber clean, reduce maintenance time and cost;

Intelligent nitrogen monitoring and control system and valve control, according to the oxygen content in the chamber, automatically adjust valve opening ratio (from 0---100%) to ensure the chamber stability, also to save the nitrogen consumption to maximum. Our nitrogen consumption is only 50% of other competitors, helping customers to control the production cost of nitrogen consumption;

6. High performance and durable seals are used, advanced design ensures good air tightness, the oven achieves a minimum of 20 PPM oxygen content, and keep the set values very well;

7. User-friendly operation interface, advanced touch screen technology; using USB to secure installation, software backup, easy to operate. Program backup, restore, data import& export, save all the time information of the software system to facilitate engineers to track and share any anomalies; there is an optional MES system for easy tracking the situation of the products in the oven (widely used in automotive and other important industry);

8. Automatic switch on/off function, convenient for operators to save time, especially for one-shift production (for example, setting the automatic startup at 7:00 a.m. on Monday morning and 6:00 p.m. automatic shutdown);

9. Wide range of applications for all SMT production soldering processes. Preheating zone can be set to a maximum of 300-350 ℃, vacuum zone can be set to a maximum of 300 ℃.

10. Patented in-line vacuum system, can reduce void rate by 99%. The standard width of vacuum chamber is 510

Reflow Oven SPECIFICATION