Form Factor | Tower or 4U Rack |
Processor | One or two third-generation Intel Xeon Scalable processor (formerly codenamed "Ice Lake"). Supports processors up to 36 cores,core speeds of up to 3.6 GHz, and TDP ratings of up to 250W. |
Memory | 32 DIMM slots with two processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel(DPC). Lenovo TruDDR4 RDIMMs and 3DS RDIMMs are supported. DIMM slots are shared between standard system memory and persistent memory. DIMMs operate at up to 3200 MHz at 2 DPC. |
Drive Bays | 2.5-inch drive bays: * Up to 32x 2.5-inch hot-swap bays (16x NVMe) plus 2x 5.25-inch media bays 3.5-inch drive bays: * Up to 16x 3.5-inch hot-swap bays (8x NVMe) (no media bays) * Up to 12x 3.5-inch hot-swap bays (8x NVMe) plus 2x 5.25-inch media bays * Up to 12x 3.5-inch simple-swap bays plus 2x 5.25-inch media bays Internal drives for OS boot or drive storage: * Internal M.2 module supporting up to two M.2 drives |
Power Supply | Up to two hot-swap redundant AC power supplies, 80 PLUS Platinum or 80 PLUS Titanium certification. 750 W, 1100 W, 1800 W and 2400 W AC options, supporting 220 V AC. 750 W and 1100 W options also support 110V input supply. In China only, all power supply options support 240 V DC. |