MachineU > China Products > Chemicals > Adhesives & Sealants
Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPU
Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPU
Specifications
Brand Name :
Thinkbond
Model Number :
ThinkBond 40T
Place of Origin :
China
Packaging Details :
20L/200L
Delivery Time :
15-20 working days
MOQ :
None
Price :
0-99usd
Payment Terms :
T/T
Supply Ability :
20T/month
Odor :
Solvent
Form :
Liquid
Type :
Adhesive
Color :
Yellow
Shelf Life :
24 Months
Application :
CPU to metal bonding
Description

Clear One-Component Solvent-Based Bonding Agent for CPU/MPU/TPU

Product Description:
Thinkbond 940T is a Clear One-Component Solvent-Based Bonding Agent for CPU , MPU and TPU to hard substrates.
Hard substrates include: metal substrates (steel, iron, aluminum, etc.) and non-metal substrates (epoxy resin, glass-reinforced plastics, polyphenylene sulfide, polyetheretherketone, polyethersulfone, etc.).
Thinkbond 940T is a heavy metals free product.
BENEFITS:
Thinkbond 940T is a one coat bonding system for PU’s and TPU’S to all metals during the curing process.
Thinkbond 940T will also bond polyurethane elastomers to polyamides and other engineering thermoplastics, such as Hytrel® , polyester, PES, PPS and PPO, at 80ºC or above.
Thinkbond 940T has excellent environmental resistance to hot and cold water, fluids.
TYPICAL PHYSICAL PROPERTIES:
Appearance Yellow liquid
Non-volatile solids (1h @ 105°C) 21-25%
Specific gravity at 25°C 0,85-0.89 g/cm3
Viscosity Brookfield at 25°C 270 cps - #2 spindle @ 30 rpm
Viscosity Ford Cup # 4 at 25°C 70 s
Diluents Isopropyl alcohol, ethanol, toluene
Bonding Temperature Range

70 to 205ºC (Casting bonding process)

150 to 230°C (TPU injection molding bonding process)
Shelf life 2 years (closed can below 25ºC)

CHEMICAL COMPOSITION:
Resins and catalysts stabilized in organic solvents.
METAL SURFACE PREPARATION:
Prepare the metal surface properly by removing completely oil, grease and dirt.
Blasting the surface with grit blasting steel so that the surface roughness is greater than 15 µm.
For aluminum surfaces we recommend the use of aluminum oxide as abrasive.
Clean again the substrate to remove dust from blasting residues.
If specified, the metal part can be phosphatized, galvanized, chromate conversion treated or KTL, before applying adhesive.
APPLYING Thinkbond:
Agitation: We recommend stir Thinkbond 940T before the application to avoid settle down.
Brushing: Application by brushing is normally undertaken without further dilution, but for coating large areas, dilution with MEK (or the diluent blend shown below) improves flow and speed of application.
Spraying: We recommend an HVLP gun using 1.5 Bar air-pressure and a nozzle size of 1 - 1.5mm. For this application we recommend diluting between 50 and 100% v/v.
Roller coating: Dilute to 35 - 45 seconds on a DIN 4 or Ford 4 cup at 25 C for most roller application processes. Dilution with a high boiling solvent like MPA may be necessary to achieve the best finish and to reduce the skinning of the bonding agent in the applicator.
Drying: Dry the film between 10 and 30 minutes at room temperature. If it is necessary to reduce drying time, we recommend to use forced air for 5 minutes at 100ºC maximum. Do not use in this stage temperatures above 100ºC to avoid adhesive pre-cure.
After this process, follow to cure.
Thickness of application layer: The film obtained by applying Thinkbond 940T is colorless. The layer thickness must be between 15 and 25 µm.
For severe environments or dynamic fatigue applications, use ≧25 microns. Under these conditions it is possible to achieve bonds with no edge-failure after 400 hour salt-spray tests
Parts with Thinkbond 940T already applied can be stored for 30 days prior to cure.
STORAGE:
Keep container tightly closed during storage and always keep away from heat sources. Store in anenvironment below 10ºC increases the shelf life of the adhesive.
Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPUClear One Component Solvent Based Bonding Agent For CPU/MPU/TPU

Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPU

Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPU

Shanghai LoreChem Co., Ltd. was established in 2008. It is a high-tech enterprise which is dedicated to serve releasing products which involve semi-permanent release agent, anti-sticking, surface lubrication and thermal reactive adhesive. Shanghai LoreChem has been improving product quality for 15 years. The releasing products are mainly applied in rubber, polyurethane and composite industry. The brand of Lubekote for release agent and Thinkbond for adhesive have been registered in China. Both of them are well known in the industry.
Shanghai LoreChem 's business is all over the domestic and foreign high-end production enterprises by providing professional technical solutions and services. The company's long-term goal is to become one of the best suppliers of release agent in Asia.

Shanghai Lorechem Co., Ltd. was established in 2008. It is a high-tech enterprise which is dedicated to serve releasing products which involve semi-permanent release agent, anti-sticking, surface lubrication and thermal reactive adhesive.
Send your message to this supplier
Send Now

Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPU

Ask Latest Price
Product Detail
Brand Name :
Thinkbond
Model Number :
ThinkBond 40T
Place of Origin :
China
Packaging Details :
20L/200L
Delivery Time :
15-20 working days
MOQ :
None
Contact Supplier
Clear One Component Solvent Based Bonding Agent For CPU/MPU/TPU

Shanghai Lorechem Company Limited

Verified Supplier
1 Years
shanghai, shanghai
Since 2018
Business Type :
Manufacturer, Seller
Main Products :
Rubber Mold Release Agent, Brake Slack Adjuster, PU Mold Release Agent
Total Annual :
1000000-1500000
Employee Number :
60~100
Certification Level :
Verified Supplier
Discover similar products
View More
Watch related videos

Find Similar Products By Category:

Supplier Homepage Products Rubber Adhesive
MachineU China Products Chemicals Adhesives & Sealants
Contact Supplier
Submit Requirement