Electronic Potting Silicone Encapsulants RTV184 Transparent Silicone Electrical Potting Compound
Product Description
Silicone MCSIL-E184 is supplied as a two-component 10 to 1 liquid silicone addition cure system. Silicone MCSIL-E184 consists of Part A and Part B. When two components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications.
Technical datasheet of Electronic Potting Silicone Encapsulates
Item No. | MCSIL-E184 |
Appearance | Transparent |
Viscosity | 3000~4000 |
Mix ratio | 10:1 |
Working Time | 90 mins |
Curing time | 24-48 hours |
Hardness | 42 shore A |
Heat Cure Time at 100ºC | 30-40 minutes |
Heat Cure Time at 150ºC | 10 minutes |
Thermal conductivity | 0.27 W/m ⁰K |
Volume resistivity | 2.9E+14 ohm*cm |
Dielectric Strength | 19 kV/mm |
Tensile strength | 6.7 Mpa |
Dielectric Constant at 100 kHz | 2.68 |
Applications
Silicone is a general purpose compound suited for adhesive and coating. This cost-effective silicone can be used in a variety of electronic potting applications including the adhesive and coating for solar power, HID, LCD displayers, circuit board and electronic components, etc.
Features
Good Flow ability
Room temperature and heat cure
Good dielectric properties
Rapid, versatile cure processing controlled by temperature
High transparency allows easy inspection of components
Instruction :
Preparing Surfaces
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer.
Processing & Curing
MC Silicone E184 part A and Part B should be thoroughly mixed at a 10:1 ratio , may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. MC silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table.
Pot life and curing rate
Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is defined as the time required for viscosity to double after base and curing agent are mixed and is highly temperature and application dependent. Please refer to the data table.
Useful Temperature Ranges
For most uses, silicone elastomers should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low and high temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations and should be adequately tested for the particular end-use environment.
Precautions
Packing and Storage
1. Silicone rubber is shipped as kits that Part A and B liquid components in separate containers. It is available in packing in 5kg or 20kg,200kg per pail.
2. Silicone rubber must be tightly sealed in cool and dry place, prevented from sun and rain. Transport by non-dangerous goods.
Storage & Transportation of Electronic Potting Silicone Encapsulates
Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.It can be stroked and transported as non-dangerous goods.