Good Flowability Two-part Silicone Potting Compound And Encapsulants For Electronics

Product Description

MC Silicones delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy application cases. Silicone encapsulants are protective materials used to completely embed electronic circuitry. Typically, they are used to protect circuits from harmful effects of moisture and other contaminants, provide electrical insulation for high voltages and also protect the circuit and interconnections from thermal and mechanical stress.

MC Silicone encapsulants are supplied as solventless, two-component liquid component kits. Many are designed for a 1:1 mixing ratio (parts A and B). When the two liquid components are thoroughly mixed, the mixture cures to a flexible elastomer. Some products will cure at room temperature while others are designed to be cured by heat.

Features
• Good flowability
• Room temperature or heat accelerated cure
• Moderate thermal conductivity
• UL 94V-0

Benefits
• Rapid, versatile cure processing controlled by temperature
• Can be considered for uses requiring added flame resistance

Composition
• White and Black/Dark Grey
• 1 to 1 Mix Ratio
• Polydimethylsiloxane

Technical datasheet of Electronic Potting Silicone Compound& Encapsulates

Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.

MIXING AND DE-AIRING
These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.

PREPARING SURFACES
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone encapsulant.

PROCESSING/CURING
Thoroughly mixed silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/ dispensed. MC silicone encapsulants may be either room temperature (25 °C/77 °F) or heat cured.

POT LIFE AND CURE RATE
Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed and is highly temperature and application dependent. Please refer to the data table.

LIMITATIONS
This product is neither tested nor represented as suitable for medical or pharmaceutical uses.

Packaging of Electronic Potting Silicone Encapsulates

Packs are available in 20kg and 200kg per drum.

Storage & Transportation of Electronic Potting Silicone Encapsulates

USABLE LIFE AND STORAGE

Shelf life has 12 months after the production date.
Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Exposure to moisture could reduce adhesion and cause bubbles to form. Encapsulant materials which contain higher levels of fillers that have been stored for long periods of time should typically be agitated or rolled prior to mixing to prevent separation and settle-out.