中心频率f0 (6dB带宽中心)

Center Frequency f0 (Center of 6dB Bandwidth)

插入衰耗(最小损耗点)

Insertion Loss (At minimum loss point)

温度稳定性 (－20℃～ +80℃ )

Temperature Stability (－20℃～ +80℃ )

±0.5% max

(-25℃ ～ +80℃)

测 试 项 目

Item

测 试 条 件

Measurement condition

性 能 要 求

Requirement

自由跌落

Random Drop

滤波器从0.3 米的高度自由落到水泥地面上3 次后再测.

Filter shall be measured after 3 times random drops from the height of 30cm on concrete floor

没有可见损伤,且测得值

满足表1.

No visible damage and it

meet Table 1

振 动

Vibration

振动幅度为1.5mm,其振动频率为10-55Hz.振动沿三个互相垂直的方向进行,各2 个小时.

Filter shall be measured after being applied vibration of amplitude of 1.5mm with 10-55Hz band of vibration frequency to each of 3 perpendicular directions for 2 hours

没有可见损伤,且测得值

满足表1.

No damage and it meet

Table 1.

可 焊 性

Solderability

引线端子须插入助焊剂中5 秒,后浸入230±5℃的焊接槽中3±0.5 秒.

Lead terminals are immersed in aide solder for 5 sec and then immersed in soldering bath of 230±5℃, for 3±0.5 sec.

最少95%的引线脚端子须浸上焊料.

At least 95% lead terminals shall be covered with solder.

基板弯曲试验

Substrate Bending Test

按箭头所示方向将基板以每秒0.5mm 的速度弯

曲(见图3),弯曲到3mm时,保持30 秒.

Apply pressure in the direction of arrow (see Fig. 3)

at a rate of about 0.5mm per second until it reaches a

bend of 3mm and hold for 30 seconds.

It shall meet table 1.

测得值需满足表1.

７－5

结合力

Adhesion

按箭头所示方向施加固定的20N的压力于产品中

心部分(见图4),时间保持10 秒.产品需快速

地,紧紧地被焊接在印刷电路板上.

A static load of 20N to the direction of the arrow (see

Fig. 4) shall be applied on the core of the component

and hold for 10 seconds. Filter shall be soldered

correctly and tightly to PCB.

It shall meet Table 1.

测得值满足表1.

回流焊接

Reflow Soldering

将焊接膏放在印制线路板上(见图5),产品安装

好后,在所示条件下焊接(见图6),测量前在常

温中放置24 小时.

Put on the solder paste on the printed wiring board (pattern is shown in Fig. 5), the samples shall be mounted and soldered under the condition (pattern is shown in Fig. 6), then it shall be subjected to the room atmosphere for 24 hours prior to the measurement.

It shall meet Table 1.

测得值需满足表1.

测试项目

Item

测 试 条 件

Measurement condition

性 能 要 求

Requirement

湿度试验

Humidity

将滤波器放在相对湿度为90－95%,温度为+40±2℃的湿度箱中100 小时,后置于自然环境中1 小时,再进行测试.

After being placed in a chamber with 90-95%

R.H. at 40±2℃ for 100 hours and then being

placed in room temperature for 1 hour, filter shall be measured.

测得值必须满足表1 的

要求.

It shall meet Table 1.

耐焊接热

Resistance to

Solder Heat

引线端子应插入350±10℃的焊接槽中3±0.5秒或260±5℃的焊接槽中10±1 秒,插入深度为滤波器主体1.5mm,而后放在自然环境中1 小时,再进行测试.

Lead terminals are immersed up to 1.5mm from filter’s body in soldering bath of 350±10℃, for 3±0.5 sec. And then filter shall be measured after being placed in room temperature for 1 hour.

测得值必须满足表1 的

要求.

It shall meet Table 1.

高温试验

High

Temperature

将滤波器放在+80±2℃的温箱中100 小时,后置于自然环境中1 小时,再进行测试.

After being placed in a chamber with 80±2℃,for 100 hours and then being placed in room temperature for 1 hour , filter shall be measured.

测得值须满足表1.

It shall meet Table1

低温试验

Low

Temperature

将滤波器放在-20±2℃的温箱中100 小时,后置于自然环境中1 小时,再进行测试.

After being placed in a chamber with -20±2℃,for 100 hours and then being placed in room temperature for 1 hour, filter shall be measured.

测得值须满足表1.

It shall meet Table 1

热冲击试验

Heat Shock

将滤波器从室温中取出,置于-55℃的低温中30 分钟,后立即置于+85℃的高温中30 分钟,然后再回到-55℃的低温中,如此循环5 次,再将滤波器置于自然环境中1 小时,再进行测试.

After being kept at room temperature, filter shall be placed at temperature of –55 ℃ , for 30 minutes, then be placed at temperature. 85℃, for 30 minutes. After that returned to –55℃ again. Repeated above cycle for 5 times. After being kept in room temp. for 1 hour, filter shall be measured

测得值须满足表1.

It shall meet Table 1

测试项目

Item

规格

Specification