The specification shall cover the characteristics of four leads SMD ceramic filter with 455KHz in middle-frequency circuit of communication equipment.
2.Spec No.:
4.Electrical Characteristics
NO. | Item | Specification |
4 – 1 | Center Frequency f0 (Center of 6dB Bandwidth) | 455±1.0KHz |
4 – 2 | Bandwidth(3dB) | ±5.0KHz min |
Bandwidth(6dB) | ±7.5KHz min | |
Bandwidth(50dB) | ±15.0KHz min | |
4 – 3 | (fo±100KHz) Stop Band Attenuation | 45dB min |
4 – 4 | Ripple (f0±5 khz) | 2.0dB max |
4 – 5 | Insertion Loss (At minimum loss point) | 5.0dB max |
4 – 6 | Temperature Stability (-20℃~ +80℃ ) | ±0.5% max (-25℃ ~ +80℃) |
4-7 | Operating Temperature | -20℃ ~ +80℃ |
4-8 | Storage Temperature | -40℃ ~ +85℃ |
4-9 | Insulation Resistance(DC 25V 1 minute) | 100MΩ min |
4 – 10 | Input/Output Impedance | 1.5 KΩ |
5-1. Measurement Condition
Measurement shall be carried out at the standard temperature of 25±2℃. If no specific
requirements, Test can be carried out under 5-35℃.
5-2. Measuring Circuit
6.outline
6-1.Appearance:Mark shall be clear,appearance shall be smooth and no damage.
6-2.Dimensions:(mm)
7.Physical Characteristics
NO. | Item | Measurement condition | Requirement |
7-1 | Random Drop | Filter shall be measured after 3 times random drops from the height of 30cm on concrete floor |
No visible damage and it meet Table 1 |
7-2 |
Vibration
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Filter shall be measured after being applied vibration of amplitude of 1.5mm with 10-55Hz band of vibration frequency to each of 3 perpendicular directions for 2 hours | No damage and it meet Table 1.
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7-3 | Solderability | Lead terminals are immersed in aide solder for 5 sec and then immersed in soldering bath of 230±5℃, for 3±0.5 sec. | At least 95% lead terminals shall be covered with solder. |
7-4 | Substrate Bending Test | Apply pressure in the direction of arrow (see Fig. 3) at a rate of about 0.5mm per second until it reaches a bend of 3mm and hold for 30 seconds. | It shall meet table 1.
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7-5
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Adhesion | A static load of 20N to the direction of the arrow (see Fig. 4) shall be applied on the core of the component and hold for 10 seconds. Filter shall be soldered correctly and tightly to PCB. | It shall meet Table 1.
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7-6 | Reflow Soldering | Put on the solder paste on the printed wiring board (pattern is shown in Fig. 5), the samples shall be mounted and soldered under the condition (pattern is shown in Fig. 6), then it shall be subjected to the room atmosphere for 24 hours prior to the measurement. | It shall meet Table 1.
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8.Environmental Characteristics
NO. | Item | Measurement condition | Requirement |
8 – 1 |
Humidity | After being placed in a chamber with 90-95% R.H. at 40±2℃ for 100 hours and then being placed in room temperature for 1 hour, filter shall be measured. | It shall meet Table 1. |
8 – 2 | Resistance to Solder Heat | Lead terminals are immersed up to 1.5mm from filter’s body in soldering bath of 350±10℃, for 3±0.5 sec. And then filter shall be measured after being placed in room temperature for 1 hour. | It shall meet Table 1. |
8 – 3 | High Temperature | After being placed in a chamber with 80±2℃,for 100 hours and then being placed in room temperature for 1 hour , filter shall be measured. | It shall meet Table1 |
8 – 4 | Low Temperature | After being placed in a chamber with -20±2℃,for 100 hours and then being placed in room temperature for 1 hour, filter shall be measured. | It shall meet Table 1 |
8 – 5 | Heat Shock | After being kept at room temperature, filter shall be placed at temperature of –55 ℃ , for 30 minutes, then be placed at temperature. 85℃, for 30 minutes. After that returned to –55℃ again. Repeated above cycle for 5 times. After being kept in room temp. for 1 hour, filter shall be measured | It shall meet Table 1 |
Table 1
Item | Specification |
Center Frequency | 455±1.0 KHz max |
Bandwidth(6dB) | ±7.5 KHz min |
Selectivity(50dB) | ±15.0KHz max |
Stop Band Attenuation | 27dB min |
Ripple | 2.0dB max |
Insertion Loss | 5.0dB max |