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2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
Specifications
Brand Name :
Leadsintec
Model Number :
PCBA
Certification :
IATF16949, ISO13485, ISO9001
Place of Origin :
Shenzhen
MOQ :
1pcs
Price :
Negotiable (Depends on your gerber and bom)
Payment Terms :
L/C, T/T, D/A, D/P, Western Union
Supply Ability :
80000pcs/month
Delivery Time :
1-30days
Packaging Details :
PCB: Vacuum Packing / PCBA: ESD Packing
Product name :
Automotive PCB Assembly
Copper thickness :
1/2OZ 1OZ 2OZ 3OZ
Base material :
FR-4
Surface finishing :
HASL/OSP/ENIG
Solder mask color :
White Black Yellow Green Red
Layers :
1-58layers
Item :
ODM OEM LED PCBA
Pcb test :
Flying probe and AOI (Default)/Fixture Test
Pcb assembly method :
Through-hole
Description

2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

Automotive PCB Assembly Contract Manufacturing 2 Layer Solder Mask Electronic PCBA

What Can LeadsintecDo?

Leadsintec is a professional PCB / PCBA Manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first-class manufacturer of PCB / PCBA. From multi-layered to flexible printed circuit boards, Leadsintec is your one-stop-shop. We provide our customers with PCB Manufacturing, PCB Assembly, and Parts Sourcing services to save your time & cost.

Flex PCB Capability :

Items Type Normal Manufacturing Capability
Standard Deliverable Inspection Std. IPC-6013 Class2, IPC-A-600G Class2
Test Std. IPC-TM-650,GB/T4677-2002
Material DuPont AL9111R, AP9121R, AP9131R, AP8525R
Panasonic R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M
Taiflex NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THK D200520JY
Process capacity Layers 0-14
Thickness 0.07-4.0mm
Max dimension 10X18 Inch
Min precision Of Dim ±4mil
Min diameter of holes 4mil (Laser drill); 8mil(mechanical drill)
Aspect ratio 10:1

Min trace width/sp ce outer

layer(0.5OZ )

 3.0/3.0mil

Min trace width/space outer

layer(1OZ )

 3.5/3.5mil

Min trace width/space outer

layer(2OZ )

 5/5mil

Min trace width/space

inner layer(0.5OZ )

 3.5/3.5mil

Min trace width/space

inner layer(1OZ )

 4/4mil

Min trace width/space

wtidth of gridding circr

 5/5mil

Min trace width/space

wtidth of out layer

5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)；

8/5.5mil(2oz copper)；

Min distance Between

drilling&conductor(via holes)

 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers)

Min distance Between

drilling&conductor(compon ent holes)

 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers)

Min distance Between

drilling&conductor(buried

&blind holes)

 7mil

Min ring of inner layer(via

holes)

 5mil(≤6 Layers) ；8mil(＞8Layers)

Min ring of inner

layer(component holes)

 8mil(≤6Layers) ；11mil(＞8Layers)
The vias to the coalescent location of rigid and flex 1mm
HDI board 1+n+1
Surface treatment Plating Gold(Hard gold) Normal:0.25-0.76um;Hard gold:0.76-2um；
ENIG Ni:3--8um,Au:0.05-0.1um
Immersion Tin 0.80-1.20um
Immersion Silver 0.10-0.30um
0SP 0.15-0.30um
HASL 2-40um
HASL lead free 2-40um
Silver ink 10-25um
Selective surface finishing ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.
Min. bended radius single side flex 3-6 times the flex thickness
double sides flex 6-10 times the flex thickness
multi-layers flex 10-15 times the flex thickness
dynamic bending 20-40 times the flex thickness

Rigid-Flex PCB Capability :

Items Type Normal Manufacturing Capability
Standard Inspection Std. IPC-6013 Class 2, IPC-A-600G Class 2, IPC-6013 Class 3
Test Std. IPC-TM-650,GB/T4677-2002
Material DuPont AL9111R, AP9121R, AP9131R, AP8525R
Panasonic R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M
Taiflex NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520
No Flow PP VT-47N,VT-901
CCL ITEQ IT180A , ShengYi 1000-2,N4000-13, Rogers4350B,4003C
Process capacity Layers 2-20
Thickness 8-118mil
Max dimension 15.74X28 Inch
Min precision Of Dim ±4mil
Min diameter of holes 4mil (Laser drill); 6mil(mechanical drill)
Aspect ratio 16:1

Min trace width/space

wtidth of outer

3.0/3.0mil

Min trace width/space

wtidth of outer

3.5/3.5mil
wtidth of outer layer(2OZ finished 5/5mil

Min trace width/space

wtidth of inner

 3.5/3.5mil

Min trace width/space

wtidth of out layer(1OZ

 4/4mil
Min trace width/space wtidth of gridding circr 5/5mil

Min trace width/space

wtidth of out layer(2OZ finishedcopper,Flex layer on top or bottom)

5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)；8/5.5mil

(2oz copper)；

Min distance Between

drilling&conductor(via holes)

 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers)

Min distance Between

drilling&conductor(com ponent holes)

 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers)

Min distance Between

drilling&conductor(burie d &blind holes)

 7mil

Min ring of inner

layer(via holes)

 5mil(≤6 Layers) ；8mil(＞8Layers)

Min ring of inner layer(component holes)

 8mil(≤6Layers) ；11mil(＞8Layers)

coalescent location of rigid and flex

 1mm
HDI board 1+n+1
Surface treatmen t Plating Gold(Hard gold) Normal:0.25-0.76um;Hard gold:0.76-2um；
ENIG Ni:3--8um,Au:0.05-0.1um
Immersion Tin 0.80-1.20um
Immersion Silver 0.10-0.30um
0SP 0.15-0.30um
HASL 2-40um
HASL lead free 2-40um
Silver ink 10-25um
Selective surface finishing

ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+

GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.
Routing Outline Tol. +/-4mil

2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

Leadsintec has been selected as the “excellent partner of the year” by numerous well-known enterprises, and won many domestic and authorized certifications at home and abroad, such as Chinese high-tech project certification, ISO9001, ISO14001, ISO13485, IATF16949 quality management system standard, and customized CE, UL, FCC, and other product certifications according to the customer's requirements.

2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

100% PCB PCBA Testing:

2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

Millions of circuit boards are produced here every year, which provides superior service for automotive electronics, medical electronics, power communications, industrial automation, military, aviation & aerospace, intelligent home, and other industries around the world. We will continue to improve our quality and service; customer satisfaction and the development of science and technology are our eternal motivation.

Product tags

eps molding

,

ibr polycarbonate sheeting

,

nbr sbr rubber sheet
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2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

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Product Detail
Brand Name :
Leadsintec
Model Number :
PCBA
Certification :
IATF16949, ISO13485, ISO9001
Place of Origin :
Shenzhen
MOQ :
1pcs
Price :
Negotiable (Depends on your gerber and bom)
Contact Supplier
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

Shenzhen Leadsintec Technology Co., Ltd

Active Member
4 Years
shenzhen
Since 2004
Business Type :
Manufacturer
Main Products :
SMT PCBA Assembly, Industrial PCB Assembly, Medical PCB Assembly
Total Annual :
10,000,000-100,000,000
Employee Number :
100~300
Certification Level :
Active Member
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