Specifications
Brand Name :
Leadsintec
Model Number :
PCBA
Certification :
IATF16949, ISO13485, ISO9001
Place of Origin :
Shenzhen
MOQ :
1pcs
Price :
Negotiable (Depends on your gerber and bom)
Payment Terms :
L/C, T/T, D/A, D/P, Western Union
Supply Ability :
80000pcs/month
Delivery Time :
1-30days
Packaging Details :
PCB: Vacuum Packing / PCBA: ESD Packing
Product name :
Power Bank Circuit Board
Copper thickness :
1/2OZ 1OZ 2OZ 3OZ
Surface finishing :
HASL/OSP/ENIG
Solder mask color :
White Black Yellow Green Red
Application :
Electronic Products pcb assembly
Testing service :
E-test/Fixture test/Functional Test
Description

94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

SMT DIP Service Power Bank PCB Circuit Boards Assembly SMT EMS PCBA Board Power Converter Supply Switch PCB Assembly

ABOUT Leadsintec

Leadsintec has been established in 2007, located in Shenzhen city, mainland China, are a professional China PCB assembly factory, providing services of PCB Assembly, electronic parts sourcing, PCB fabrication, and functional test for customers all over the world.

We offer low-volume, Prototype, and Production PCB fabrication services, for rigid or flexible, rigid-flexible, aluminum, RoHS compliant, High Tg boards. All project comes with satisfaction guarantee and on-time delivery.

Rigid PCB Manufacture Capabilities
ITEM TECHNICAL PARAMETER
LAYERS 1-48
Max.Board Size 460mm×700mm
Board Thickness 0.25-6.0mm 10mil-152.4mil
Min. Line Width 0.075mm 3mil
Min Space 0.075mm 3mil
Min Hole Size(Mechanical) 0.2mm 8mil
Min Hole Size (Laser) 0.10mm 4mil
PTH Wall Thickness >0.025mm 1mil
PTH Hole Dia Tolerance ±0.076mm 3mil
Non PTH Hole Dia Tolerance ±0.05mm 2mil
Hole Position Deviation ±0.05mm 2mil
Outline Tolerance ±0.13mm 3mil
V-cut 30°/45°/60°
Impedance Control +/- 7%
Fire Resistance 94V0
Max copper weight(inner) 6 oz
Peel-off Strength 1.4N/mm
Soldermask Abrasion >7H
Solderability Test 260℃20 second
Flammability 94v0
E-test Voltage 50-300v
Bow/Twist ≤0.75%
Surface Finishing HAL,Entek,Flash gold,Gold finger,OSP
Immersion gold,Immersion Tin,Immersion Silver,Lead free HAL
Base Laminate Type FR4,Tg 130℃/Tg170℃,Aluminum base,Rogers, (taconic,Arlon,Nelco,Isola…),Halogen free

94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

Flexible PCB Manufacture Capabilities

FPC Capacity
Item Routine Special
Layers 1-12 12 layers above
Board Size(Max) ①500mm×500mm
②100000mm×500mm (R-T-R)
Board Thickness 0.060mm—2.5mm 4mm(Flex-rigid Board)
CNC hole Size(Max) 6.5mm
CNC Hole Size(Min) 0.2mm 0.15mm
CNC Hole Diameter Tolerance ±0.025mm
CNC Drilling Slot Length and Width Ratio 2∶1
Hole(inner) Copper Thickness Min:10μm Max:38μm
Min Line Width/ Line Space 0.075/0.075 mm 0.05/0.05mm
Etching Tolerance ±20%( Min Tolerance±0.03mm)
The Accuracy of Graphics to Graphics ±3mil ( ±0.0762mm)
The Accuracy of Graphics to Holes ±2mil ( ±0.0508mm)
Cover Film Tolerance ±8mil (±0.20 mm) ±4mil(±0.10 mm)
Thermal Curable Ink/UV Ink Location Tolerance ±0.2mm ±0.15mm
Green Oil Bridge( Min) 0.1mm 0.075mm
Min Electrical Test Pads 8mil X 8mil 6mil X 6mil
Outline Dimensions Min Tolerance(Edge-to-Line) ±0.15mm ±0.125mm
Finger Edge Spacing ±0.15mm ±0.125mm
Outline Dimensions Min Tolerance ±0.1mm ±0.05mm
Min R Angular Radius (Filleted Corner) 0.2mm

94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

Metal base PCB Manufacture Capabilities

Item Technical Parameter
Material Aluminum base, copper base, Iron base
Surface finish Chemical Gold, HASL, Immersion Tin, Chemical Silver, OSP
Layer Single layer, 2 Layer, 4 Layer
MAX Size 1185mm*480mm
Min Size 5mm*5mm
Min line space&width 0.1mm
Warpage ≤0.5%(thickness:1.6mm, size:300mm*300mm
Board thickness 0.3-5.0mm
Copper weight 35um-240um
Outline tolerance ±0.15mm
V-CUT tolerance ±0.1mm
Manufacturing capacity 7000m2/Month
Via positioning deviation ±0.076mm

Testing Procedures
We perform multiple quality assurance procedures to make sure the PCBs board we are going to ship are 100% qualified.
These include:
• Visual Inspection
• Flying probe
• Bed of nails
• Impedance control
• Solder-ability detection
• Digital metallographic microscope
• AOI (Automated Optical Inspection)

94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

The PCB products we manufactured are extensively used in various fields including:
Communications: IP PBX, Smart Gateway, Conference servers, 4G Routers
Industrial Control: Industrial Computer, Industrial Power Supply, Industrial Automation Robot Controller, Elevator Controller, 3D Printer, Industrial Laser Controller.
Medical Instruments: ECG Monitor, Colour Ultrasonic Diagnosis, Pregnancy Monitor, Hospital Nursing Systems.
IOT/AI: Smart Water Valve, Smart Home, Smart Electric Meter, Smart Buildings, Smart Oil Depot Management Systems.
Power Supply: Automobile Battery Charger, Industrial Power Supply, Frequency Converter.
Security: Security Camera, Smart Door Lock, Access Control Systems, Drive Recorder.
Automobile:OBD-II Systems, Vehicle Tracking Systems, Fleet Management Systems, Vehicle Parking System

94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

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94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

Ask Latest Price
Brand Name :
Leadsintec
Model Number :
PCBA
Certification :
IATF16949, ISO13485, ISO9001
Place of Origin :
Shenzhen
MOQ :
1pcs
Price :
Negotiable (Depends on your gerber and bom)
Contact Supplier
94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil
94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil
94V0 SMT DIP Assembly Power Bank Circuit Board Low Volume 3mil

Shenzhen Leadsintec Technology Co., Ltd

Active Member
4 Years
shenzhen
Since 2004
Business Type :
Manufacturer
Total Annual :
10,000,000-100,000,000
Employee Number :
100~300
Certification Level :
Active Member
Contact Supplier
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