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12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
Specifications
Brand Name :
KAZ
Model Number :
PCB-S-HDI-001
Certification :
ISO9001, UL, RoHS
Place of Origin :
China
MOQ :
1
Price :
100
Supply Ability :
20000 sq.m / month
Delivery Time :
25~30
Packaging Details :
vacuum
layers :
12
material :
FR-4 Tg150
Min Line :
2 mil
PCB Type :
HDI
Blind & Buried Via :
Yes
Impedance Control :
Yes
Description

This is a PCB with 12 layers, min line width and space is 2mil/2mil, specialty include impedance control, blind & buried via, BGA wtih soldmask defined,

Detials for this 12 layers min 2 mil line width high Tg High Density Interconnect HDI PCB:

  • 12 layers
  • FR-4
  • Tg 150
  • ENIG surface
  • 1.6mm board thickness
  • BGA with soldmask defined
  • With inpedance control
  • With Blind & buried via

Copper Thickness:

L1-------------------------------1/3OZ + Plating

PP 3.00mil

L2-------------------------------1/3OZ + Plating

PP 2.35mil

L5-------------------------------1/3OZ + Plating

PP 2.97mil

L6-------------------------------1/3OZ + Plating

PP 2.51mil

L5------------------------------H OZ

0.2mm Core

L6------------------------------H OZ

PP 2.75mil

L7-------------------------------H OZ

0.2mm Core

L8-------------------------------H OZ

PP 2.64mil

L9-------------------------------1/3OZ + Plating

PP 2.83mil

L10------------------------------1/3OZ + Plating

PP 2.43mil

L11------------------------------1/3OZ + Plating

PP 3.09mil

L12------------------------------1/3OZ + Plating

More photoes for this 12 layers HDI PCB

12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

Product tags

high density interconnect pcb

,

fr4 pcb specification

,

hdi printed circuit boards
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12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

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Product Detail
Brand Name :
KAZ
Model Number :
PCB-S-HDI-001
Certification :
ISO9001, UL, RoHS
Place of Origin :
China
MOQ :
1
Price :
100
Contact Supplier
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards
12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

ShenZhen KaiZhuo Electronic Technology Co.,Ltd

Verified Supplier
8 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer
Main Products :
SMT PCB Assembly, Printed Circuit Board Assembly, PCB Assembly Service
Total Annual :
8,800,000-11,000,000
Employee Number :
300~350
Certification Level :
Verified Supplier
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