OEM 4 Layers Electronic Printed Circuit Boards FR4 Material ENIG 1u' Gold Finger Solder Mask.OEM brand and3Mile

Features of Electronic Printed Board

1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available

Detailed Specification

What KAZ Circuit can do for you:

• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Company Informaiton:

KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

Manufacturer Capacity:

Electronic printed circuit board (PCB) manufacturing processes:

PCB material choice:

Common base materials include FR-4 (fiberglass), polyimide and ceramics

Consider properties such as dielectric constant, thermal performance, and flexibility

Special materials available for high-frequency, high-power or flexible PCBs

Copper thickness and layer count:

Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)

Single-sided, double-sided and multilayer PCBs available

Additional copper layers improve power distribution, heat dissipation and signal integrity

Surface Treatment:

HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat

ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance

Immersion Silver - Cost effective for lead-free soldering

Additional options include ENEPIG, OSP and direct gold plating

Advanced PCB Technologies:

Blind and Buried Vias for High Density Interconnects

Microvia Technology for Ultra-Fine Pitch and Miniaturization

Rigid-flex PCBs for applications that require flexibility

High frequencies and high speeds with controlled impedance pc

PCB manufacturing technology:

Subtractive process (most common) - etching away unwanted copper

Additive process - creating copper traces on the base material

Semi-additive process - combining subtractive and additive technologies

Design for Manufacturer (DFM):

Adherence to PCB design guidelines for reliable manufacturing

Considerations include trace width/spacing, via size and component location

Close collaboration between designers and manufacturers is essential

QA and testing:

Electrical testing (e.g., online testing, functional testing)

Mechanical testing (e.g., bending, shock, vibration)

Environmental testing (e.g., temperature, humidity, thermal cycles)

Pictures