Specifications
Brand Name :
KAZ
Model Number :
PCB-B-HDI-659423
Certification :
ISO9001, UL, RoHS
Place of Origin :
China
MOQ :
1
Price :
200
Supply Ability :
20000 sq.m / month
Delivery Time :
15~20
Packaging Details :
vacuum
layers :
10
material :
FR-4 + PI
PCB Type :
Rigid Flex PCB
FPC thickness :
0.1mm
FR-4 board thickness :
1.6mm
Soldmask Color :
Green/FR4, Yellow/PI
Description

Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly

Detail Specifications:

Layers 10
Material FR-4+PI
Board Thickness

1.6mm FR4 + 0.1mm PI

Copper Thickness 1oz
Surface Treatment ENIG
Soldmask & Silkscreen Green/FR4, Yellow/PI
Quality Standard IPC Class 2, 100% E-testing
Certificates TS16949, ISO9001, UL, RoHS



What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)


Company Informaiton:

KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

Manufacturer Capacity:

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP

HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.

Key features and functions of HDI printed circuit boards include:

Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for higher interconnect density.
This makes it possible to design more compact, space-saving electronic devices and components.


Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can further increase interconnect density.


Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4 to 10 or more.
The increased number of layers allows for more complex routing and more connections between components.


Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil, high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more reliable, higher-performance interconnects.


Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter tolerances of HDI PCBs help improve electrical performance, including improved signal integrity, reduced crosstalk, and faster data transmission.


Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require specialized equipment and expertise.


HDI printed circuit board applications include:

Smartphones, Tablets, and Other Mobile Devices

Wearable Electronics and IoT (Internet of Things) Devices

Automotive electronics and advanced driver assistance systems (ADAS)

High speed computing and telecommunications equipment

Military and aerospace electronic equipment

Medical devices and instruments

The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.

More photoes

Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards

Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards

Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards

Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards

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Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards

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Brand Name :
KAZ
Model Number :
PCB-B-HDI-659423
Certification :
ISO9001, UL, RoHS
Place of Origin :
China
MOQ :
1
Price :
200
Contact Supplier
Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards
Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards
Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards
Rigid Flex HDI Printed Circuit Boards 10 Layers 1.6mm Board Thickness SMT PCB Assembly HDI Printed Circuit Boards

ShenZhen KaiZhuo Electronic Technology Co.,Ltd

Verified Supplier
8 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer
Total Annual :
8,800,000-11,000,000
Employee Number :
300~350
Certification Level :
Verified Supplier
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