Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service

This is a 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB circuit board, detail specification as below, with IPC Class 2 quality standard, panel size is 112.5*202mm .

• 4 layers
• FR-4 Tg150
• ENIG 1u"
• 1.0mm board thickness
• 1/H/H/1 oz.
• Green soldmask
• White silkscreen
• IPC Class 2

Manufacturing Capacity - Rigid PCB

PCB size: 112.5*202mm / 25 UP

IPC Class 2 quality standard.

What KAZ Circuit can do for you:

• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Company Informaiton:

KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

Manufacturer Capacity:

Multilayer PCB

Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.

Advantages of multi-layer PCBs:

Higher wiring density and complex circuit design capabilities

Better electromagnetic compatibility and signal integrity

Shorter signal transmission paths, improved circuit performance

Higher reliability and mechanical strength

More flexible power and ground distribution

Composition of multi-layer PCBs:

Inner copper foil: Provides conductive layer and wiring

Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer

Outer copper foil: Provides surface wiring and interface

Perforated metallization: Realizes electrical connection between layers

Surface treatment: HASL, ENIG, OSP and other surface treatment processes

Design and manufacture of multi-layer PCBs:

Circuit design: Signal integrity, power/ground integrity design of multi-layer boards

Layout and wiring: Reasonable layer allocation and routing optimization

Process design: Aperture size, layer spacing, copper foil thickness, etc.

Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.

More photoes for this 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB

KAZ Company information

Manufacturing Equipments - Rigid PCB

Product Applicances

Product Show - Rigid PCB