FR4 Multilayer Printed Circuit Boards Green Soldermask White Silkscreen PCB Assembly Service Multilayer PCB Board

Detail specification about Mobilephone Blue Soldermask White Silkscreen FR4 Electronic Printed Circuit Board

Brief introduction about Shenzhen KAZ Circuit Co,. Ltd.

Brief introduction

Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA custom-made manufacturer. It's commitment to high precision single, double-sided, multilayer printed circuit board and metal substrate circuit board production,which is a hightech enterprises including amnufacture, sales, service and so on.

1. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

What we can do for you

Prompt delivery: 2L: 3-5days

4L: 5-7days

24h/48h: urgent order

Company size: About 300 employees

What KAZ Circuit can do for you:

• PCB & PCBA Design
• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Manufacturer Capacity:

Multilayer PCB

Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.

Advantages of multi-layer PCBs:

Higher wiring density and complex circuit design capabilities

Better electromagnetic compatibility and signal integrity

Shorter signal transmission paths, improved circuit performance

Higher reliability and mechanical strength

More flexible power and ground distribution

Composition of multi-layer PCBs:

Inner copper foil: Provides conductive layer and wiring

Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer

Outer copper foil: Provides surface wiring and interface

Perforated metallization: Realizes electrical connection between layers

Surface treatment: HASL, ENIG, OSP and other surface treatment processes

Design and manufacture of multi-layer PCBs:

Circuit design: Signal integrity, power/ground integrity design of multi-layer boards

Layout and wiring: Reasonable layer allocation and routing optimization

Process design: Aperture size, layer spacing, copper foil thickness, etc.

Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.

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