Siemens F5 placement machine Siemens F5 placement machine High end Mounter Siemens Mounter improves work efficiency:

Description:

Surface mounting was originally called "planar mounting".

Surface-mount technology was developed in the 1960s and became widely used in the mid 1980s. By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. Much of the pioneering work in this technology was done by IBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and smaller circuit boards and, in turn, machines or subassemblies containing the boards.

Equipment characteristics:

Specifications:

1. Mounting head type: 12-nozzle collection and placement head or 6-nozzle collection and placement head and IC head
2. Cantilever number: 1
3. Mounting range: 0201 to 55 x 55 mm
4. Mounting speed (theoretical Value): 12 nozzle placement head: 11000 pieces/hour-6 nozzle placement head: 8500 pieces/hour-IC head: 1800 pieces/hour
5. Material rack support: 118 pieces , 8mm tape

6. The highest placement accuracy (4sigma):
12 nozzle collection and placement head: 90um
6 nozzle collection and placement head: 60um
IC placement head: 40um
7. Applicable substrate: 50x50mm~508 x 460mm, can choose to grow to 610mm
8. Power: 1.9KW
9. Compressed air requirement: 5.5~10bar, 300Nl/min, pipe diameter 1/2" single track/dual track optional
10. Operating system: Windows / RMOS
11. Feeding car: equipped with roulette, reel frame As well as waste bins, Waffle Plate Exchanger (WPC).