Yamaha YV100XG placement machine Simple mechanical structure to ensure durability and stability:
YAMAHA YV100XG placement machine specifications
1) high speed and high precision multi-function modular placement machine
2) 0.18 seconds/CHIP high-speed placement (best conditions) 16200 CPH (grains/hour)
3) in the condition of IPC9850, patch to speed up to 16200 CPH (equivalent to 0.22 seconds/CHIP)
4) installed 0603 components, the overall accuracy of plus or minus 50 microns, repeat precision of plus or minus 30 microns
5) a wide range of applications, from 0201 (inches) miniature components to 31 mm QFP large components
6) use two high resolution digital camera
7) CSP/BGA component of continuous welding ball recognition, including the determination of solder ball defect
8) can choose YAMAHA patents for air nozzle, which can effectively reduce the idling loss
9) the best choice
About 10) Y by high-power servo amplifier and high rigid at the ends of the screw driver.
The new development of completely fixed double drive technology can accelerate the speed and coordination
Through the drive on both ends and complete acceleration. Reduce the positioning time.
SMT Advantage:
Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.
Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.
1. Good mechanical performance under shock and vibration conditions. (Partly due to lower mass, and partly due to less cantilevering.)
2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
5. Reasonable initial cost and time of setting up for mass production, using automated equipments.
Circuit board size M type: L460 * W335 (MAX) - L50 * W50 (MIN) |
L: L460 * W440 (MAX) - L50 * W50 (MIN) |
Absolute precision fitting accuracy (mu + 3 sigma) : + / - 0.05 mm/chip, plus or minus 0.05 mm/QFP |
Install speed of 0.18 seconds 1.7 seconds/CHIP/QFP, 1608 / CHIP: 16200 CPH |
Components can be installed components 0603-31 mm, SOP/SOJ/QFP/connector/PLCC/CSP/BGA |
Size 1650 * 1408 * 1900 |
The total weight 1600 kg |
Shenzhen letter surplus lung electronics co., LTD., dedicated to electronic manufacturers to provide SMT equipment as follows:
MPM printer, Koh Young SPI, Easa reflow soldering
Siemens placement machine, FUJI FUJI SMT machine, panasonic SMT machine
The AOI, lu Vitronics Soltec reflow soldering, non-standard automation equipment, SMT machine rental lease
The SMT production line equipment, and SMT components, SMT supplementary materials, services and solutions.