Samsung SMT machine CP50 maintenance good, enables the equipment to recycle longer life and better stability
SMT Advantage:
Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.
Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.
1. Good mechanical performance under shock and vibration conditions. (Partly due to lower mass, and partly due to less cantilevering.)
2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
5. Reasonable initial cost and time of setting up for mass production, using automated equipments.
Samsung SMT machine CP50 because its use less time, good maintenance, enables the equipment to recycle longer life, higher precision, better stability, which is SMT buyers. Welcome friends to understand purchasing CP50 samsung SMT machine
CP50 samsung SMT machine
Samsung CP50 substrate size: 30 ~ 50 * 460 * 400,0.38 ~ 4.2 T
Samsung CP50 mount speed:
0.38 SEC/chip, 0.85 SEC/QFP
Samsung CP50 SMT precision:
CHIP: 0.1 mm
QFP: 0.05 mm
: samsung CP50 head 3 (including a special element)
Samsung CP50 feeder number: 104
The appearance of samsung CP50 size: 1660 * 1540 * 1370
Samsung SMT machine CP50 weight: 1315 KG
Samsung mounter CP50: |
Substrate size of Samsung CP50: 50 * 30 ~ 460 * 400,0.38 ~ 4.2t |
Mounting speed of Samsung CP50: 0.38sec/chip,0.85sec/QFP |
Mounting accuracy of Samsung CP50: CHIP:0.1mm QFP:0.05mm |
Mounting head of Samsung CP50: 3 (including a special component) |
Number of feeders for Samsung CP50: 104 |
Overall dimension of Samsung CP50: 1660 * 1540 * 1370
|
Weight of Samsung mounter CP50: about 1315kg
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Brand name | Part number | Size |
FUJI | AA84030 | NXT I 8MM W8 |
FUJI | AA84128 | NXT I 12MM W12 |
FUJI | AA84228 | NXT I 16MM W16 |
FUJI | AA84328 | NXT I 24MM W24 |
FUJI | AA84426 | NXT I 32MM W32 |
FUJI | AA84525 | NXT I 44MM W44 |
FUJI | AA84625 | NXT I 56MM W56 |
FUJI | AA2GZ03 | NXT I 72MM W72 |
FUJI | AA2HA03 | NXT I 88MM W88 |
FUJI | AB09910 | NXT II 8MM W08C |
FUJI | AB10005 | NXT II 12MM W12C |
FUJI | AB10105 | NXT II 16MM W16C |
FUJI | AB10205 | NXT II 24MM W24C |
FUJI | AB10303 | NXT II 32MM W32C |
FUJI | AB10403 | NXT II 44MM W44C |
FUJI | AB10503 | NXT II 56MM W56C |
Welcome to Surface Mount Process
This website has been created primarily to be a technical resource for surface mount process engineers and also for anyone with an interest in surface mount technology (SMT). The scope of the website will be all aspects of the manufacturing process from solder paste printing, solder paste inspection, component placement, reflow soldering through to automatic optical inspection (AOI) and will include answers to the many frequently asked questions.
Shenzhen Xinyinglong Electronic Technology Co., Ltd focuses on providing electronic manufacturers with the following SMT equipment:
MPM printing machine, Koh Young SPI, Easa reflow soldering, HELLER reflow
Siemens placement machine, FUJI Fuji placement machine, Panasonic placement machine, Universal Placement machine, Yamaha placement machine, /KNS placement machine Meilu
AOI, Vitronics Soltec reflow soldering, non-standard automation equipment, placement machine rental leasing
and other entire SMT production line equipment, as well as SMT parts, SMT supporting materials, Services and solutions.
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