Yamaha SMT machine YS100 ability of high-speed SMT machine stability in high precision:
SMT Advantage:
Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.
Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.
1. Good mechanical performance under shock and vibration conditions. (Partly due to lower mass, and partly due to less cantilevering.)
2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
5. Reasonable initial cost and time of setting up for mass production, using automated equipments.
Model: YS100 (model: KJJ - 000) |
Object substrate: L50 * W460mm W50mm ~ L510 (note 1) (note 2) |
SMT efficiency: 25000 CPH (equivalent to 0.14 seconds/CHIP) |
SMT precision: fine precision (mu + 3 sigma) : + / - 0.05 mm/QFP/CHIP, plus or minus 0.05 mm Repeat accuracy (3 sigma) : + / - 0.03 mm/QFP/CHIP, plus or minus 0.03 mm |
Object components: 0402 (mm) - - 45 mm components, SOP/SOJ, PLCC, QFP, joint, CSP/BGA, long joint (below W45 x 100 mm L) (3) (4) the components can be pasted on the height of 15 mm below (note 5) |
Element type: 126 species (* large/conversion into 8 mm tape) (note 1) 87 species (* large/converted to 8 mm, when assembling satz) |
Power specifications: three-phase AC 200/208/220/240/380/400/416 V + 10% for 50/60 Hz |
For the gas source: more than 0.45 MPa, clean and dry condition |
Dimension: L1, 665 x W1, 562 (flat side) x H1, 445 mm (cover plate above) |
Body weight: about 1630 kg (only body) |
Siemens placement machine, FUJI Fuji placement machine, Panasonic placement machine, Universal Placement machine, Yamaha placement machine, /KNS placement machine MeiluMPM printing machine, Koh Young SPI, Easa reflow soldering, HELLER reflow
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