Original Condition JUKI SMT Machine FX-1R SMT Placement Machine Good Condition Long Working Time:
Product Advantages:
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
The main advantages of SMT over the older through-hole technique are:
1. Smaller components.
2. Much higher component density (components per unit area) and many more connections per component.
3. Components can be placed on both sides of the circuit board.
4. Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.
JUKI placement machine has the advantages of high speed technology, convenient for users to operate and meet customer needs.
Take JUKI FX-3 as an example:
Description
JUKI FX-3 stands for ultra-fast, precise placement of micro-components on printed circuit boards. It is the perfect solution for companies wanting to process large volumes. Among the strong points of the FX-3 are short retooling times thanks to quick-change feeder banks as well as minimal maintenance. The user-friendly touchscreen interface plus the powerful optimisation software provide additional ease of use.
Product Description:
JUKI FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the driven system deliver real world improvements in actual throughput.
²Actual throughput may vary;
²Please download brochure for details.
Features:
Not only inherits the traditional concept of modular placement machine, and realize the high speed Mounter mount. Adjust the various parts, improves the actual mount speed.
²33,000CPH: chip (optimum condition)/ 25,000CPH: chip (IPC 9850);
²Laser mounting head *2 (8 nozzles);
²0603 (British 0201) chip-20mm square element or 26.5*11mm 0402 (British 01005) the chip is purchased at the factory.
Specifications:
Substrate size | 410*360mm |
Component height | 6mm |
Component size | Laser recognition 0603 (British 0201) chip~20mm square element or 26.5*11mm |
Element mounting speed | 33000CPH (optimum condition) |
CPH | 25000cph (IPC9850) |
Component mounting accuracy | ±0.05mm |
Component mount type | Up to 80 kinds of component placement |
Voltage | Three-phase AC200~415V |
Power rate | 3KVA |
Air pressure | 0.5±0.05Mpa |
PCB thickness | 0.2mm-6mm |
Dimension | 1880×1731×1490mm |
Weight | About 2000Kg |
Applications:
1. Manufacturing Department Production Workshop SMT Line.
2. Proper operation of the fully automatic press ensures that the machine is operating properly, thus ensuring product quality.
3. Solder Paste Printing Machine: Modern solder paste printing machine is generally composed of plates, tin paste, embossing, and transmission board. Its working principle is: firstly, the circuit board to be printed is fixed on the printing positioning table, and then the solder paste or the red glue is printed on the corresponding pad through the steel mesh by the front and rear scrapers of the printing machine, and the PCB which is uniformly printed is passed through. The transfer station is input to the placement machine for automatic placement.