Panasonic bm123 placement machine Daily maintenance, save time and effort, easy and effective:
Panasonic bm123 placement machine selects a large number of high-standard materials in the use of materials, which reduces structural wear and improves service life. · Semiconductor hard disks are used, with a capacity of 1G, and the service life is 10 times longer than that of ordinary hard disks. · Designed to avoid disassembly for maintenance. For example, it can automatically detect the cleanliness of the suction nozzle before production, so as to realize simple and practical daily maintenance, which saves time and effort, and is easy and effective
Panasonic bm123 placement machine introduction:
A, high service life
, used only on the turret some one-piece casting structure, the maximum extent to ensure the equipment overall rigidity and prolong the service life.
, use in material selection on a large number of high standard material, reducing the wear structure, improve the service life.
Using semiconductor hard disk, capacity reaches 1 g, service life is increased by ten times the ordinary hard disk.
Maintenance free disassembly type, design. For example: before production is able to automatically detect the purity of the suction nozzle, etc., realize the simple and practical daily maintenance, save time and effort, easy and effective.
Using the above design, BM series equipments can ensure the service life of the premise to realize the assembly precision long more than double than other similar equipment.
Second, the high precision SMT
Servo motor drive design, adopted the arms, realized the high precision SMT Chip: 50 microns / 3 sigma, QFP: 30 mu m / 3 sigma.
Adopted high rigid body casting design, even after 2 long distance transport directly into production SMT precision can still guarantee within 10 microns
, adopted multiple precision compensation mode (a total of 4 big item 8) : (1) to compensate automatically check accuracy suction nozzle (suction nozzle and the camera position, suction nozzle and the rack position, all the center of the suction nozzle, suction nozzle switching device's origin) (2) draw element position automatically check compensation (3) the mount position automatically check compensation (using standard substrate test ways, using common substrate test methods) (4) environmental temperature change self calibration and so on, provide strong guarantee for high precision SMT.
New added mark self search function. When mark location awareness can automatically search around correction after failure, make up for the substrate itself the error of the machining accuracy of SMT, the SMT precision is improved.
, use to detect the thickness of the element (the line - sensor) design, automatic check the thickness of the element, detecting element status, to ensure the quality of SMT.
Element is the pressure testing device, automatically determine whether the element is not hygroscopic, improve the quality of the SMT
High precision 3 d camera to ensure pasted on BGA/CSP/QFP SMT quality. Many design based on the above, BM series equipment is realized in the actual production of Cpk > 1. 3, SMT precision easily implement the single PPM (poor rate within ten over one million). And after the machine stop time control within 25 msec, amplitude control under 6 microns. (in general, low under the condition of the equipment at the same time of 74 msec), which not only greatly improve the SMT precision and stability of the equipment, and effectively ensure the security of person.
Three, high practicability
Design, implementation, use the new Head camera BM123 * high speed 30000 CPH patch. BM221 USES the same Head after the camera can achieve the same chip as the BM123 pasted on speed.
CHIP, a real installed BM123 has to install four different components of hand
Model NM-EJM6B |
Substrate size (mm) L50×W50~L330×W250 |
Mounting speed 0.12s/chip |
Mounting accuracy ±50 μm/chip(Cpk ≥ 1) , ± 30 μm/QFP (Cpk ≥ 1) |
The number of components is 80 (double tape rack: 160 ) |
Component size (mm) *1 0603 chip ~L32×W32×T15 |
Substrate replacement time *2 2.5s *6 |
Power three-phase AC200V, 220, 380, 400, 420, 480V, 2.68kVA |
Air pressure source 0.43MPa, 150L/min (ANR) |
Equipment size (mm) W1950×D1500*3×H1500 *4 |
Weight *5 1700kg (fixed supply specification) |
CHIP mounting machine BM123: Mounting speed: 0.12S/chip chip accuracy : 50 μ m/3 σ component range:metric 0603~32×32×15mm. |
Supply all original new and used SIEMENS nozzle at good price Shenzhen Xinyinglong Electronic Technology Co., Ltd focuses on providing electronic manufacturers with the following SMT equipment:
MPM printing machine, Koh Young SPI, Easa reflow soldering, HELLER reflow
Siemens placement machine, FUJI Fuji placement machine, Panasonic placement machine, Universal Placement machine, Yamaha placement machine, /KNS placement machine Meilu
AOI, Vitronics Soltec reflow soldering, non-standard automation equipment, placement machine rental leasing
and other entire SMT production line equipment, as well as SMT parts, SMT supporting materials, Services and solutions.
Sell & Buy Smt machine and spare parts.