Mini Size SMT Machine Parts SIEMENS Segment Guide Cpp 03039099 Lightweight Test in machine before shipping:

Description:
Surface mounting was originally called "planar mounting".
Surface-mount technology was developed in the 1960s and became widely used in the mid 1980s. By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. Much of the pioneering work in this technology was done by IBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and smaller circuit boards and, in turn, machines or subassemblies containing the boards.

SMT SPARE PARTS SIEMENS SEGMENT GUIDE CPP 03039099

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Product Advantages:

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

The main advantages of SMT over the older through-hole technique are:

1. Smaller components.

2. Much higher component density (components per unit area) and many more connections per component.

3. Components can be placed on both sides of the circuit board.

4. Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.