ORIGINAL NEW Yamaha belt KKE-M917H-000 TO PICK AND PLACE MACHINE Test in machine before shipping:

Description:

Surface mounting was originally called "planar mounting".

Surface-mount technology was developed in the 1960s and became widely used in the mid 1980s. By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. Much of the pioneering work in this technology was done by IBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and smaller circuit boards and, in turn, machines or subassemblies containing the boards.

Nozzle Specifications:

Supply original YAMAHA SPARE PARTS

YAMAHA AIR VALVE A010E1-54W KM1-M7163-21X

YAMAHA AIR VALVE A040-4E1-54W KM1-M7162-11X

YAMAHA APPL BOARD ASSY KM5-M4220-002

YAMAHA FLASH BOARD ASSY KM5-M4230-100

YAMAHA FV12(16) FEEDER

YAMAHA FV24(32)44 FEEDER

YAMAHA IO CONVEYOR UNIT ASSY KM5-M4580-011

YAMAHA LASER KG7-M4548-00C 6604033

YAMAHA LASER KG7-M4548-00C 6604098

YAMAHA LASER KG7-M4548-00C LAM-35-1

YAMAHA LASER KG7-M4548-00C

YAMAHA SERVO DRIVER KGA-M4100-300

YAMAHA SYSTEM BOARD

YAMAHA SYSTEM UNIT ASSY KM5-M4200-021

YAMAHA YV100A SERVO BOARD ASSY KJ0-M5840-315

YAMAHA YV100II APPL BOARD ASSY KJ0-M4220-102

YAMAHA YV100II DRIVER BOARD ASSY KJ0-M5810-E23

YAMAHA YV100II IO HEAD BOARD KV1-M4570-022

YAMAHA YV100II SYSTEM UNIT ASSY KJ0-M4200-320

YAMAHA YV100XG SERVO BOARD ASSY KM5-M5840-04X

YAMAHA YV100XG VISION CARD KV1-M441H-172

YAMAHA YV88 LAM IF BOARD KG7-M4547-100 6604030

• KME CM20F,CM301,CM402,DT401 Nozzles(2-Head)

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

The main advantages of SMT over the older through-hole technique are:

1. Smaller components.

2. Much higher component density (components per unit area) and many more connections per component.

3. Components can be placed on both sides of the circuit board.

4. Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.