SMT Assembly Machine Yamaha YV100II YS24 YS12 surface mount equipment JUKI2070
Yamaha YV100II parameters
1. Medium speed placement machine with cast iron technology
2. Protection components during mounting
3. Placement speed 0.25 seconds/CHIP
4. Placement capacity QFP 0.5 foot spacing
5. High-speed image processing
6. Dual camera, fast production efficiency
7. High rigidity frame
8. Increase the speed of the shaft
9. Can handle 80 kinds of components
10. Can mount and produce computer SIMM products
Yamaha YV100II Specifications:
Substrate size | L600*W400(Max)/L50*W50(Min) |
Substrate thickness | 0.4-3.0 |
Substrate transfer direction | Right-left |
Placement accuracy | ±0.1mm/CHIP ±0.08/QFP |
Placement speed | 0.25 sec. / CHIP 1.7 sec/QFP |
power | 4KVA |
atmospheric pressure | 0.55MPA or more, 350MIN |
Form factor | L1650*W1350*H1810 |
weight | 1300KG |
SMD speed | 12000 (chips/hour) |