1. Overview of core parameters

Model number

XD-350C-LF (presumed to be lead-free wave soldering model of Xindong Technology)

Applicable technology

Lead-free welding process (compatible with Sn/Ag/Cu, Sn/Cu and other lead-free solder)

Power requirements

Three-phase AC380V, 50Hz (industry standard)

Overall power

Total power: Approx. 25-36kW (reference 25kW of similar models GSD-WD350CE and 36kW of TB980C)

Body size

Length approx. 4-4.5 m (e.g. GSD-WD350CE 4470mm, HRD-350 4120mm)

2. Transportation system

PCB board size

Maximum width: 350mm (model suffix "350C" usually corresponds to the maximum plate width of 350mm)

Adjustable range: 50-350mm (industry general design)

Transmission speed

0.5-2m/min (refer to XD-250ML-LF transmission speed range)

Transmission structure

Double hook and claw titanium alloy chain (deformation resistance, corrosion resistance)

Imported motor drive (e.g. Panasonic or SMC cylinder)

3.Preheating system

Preheating section

Three-stage independent temperature control (industry mainstream configuration, such as GSD-WD350CE three-stage preheating)

Preheating temperature

Room temperature ~250℃ (PID closed-loop control to meet the high temperature demand of lead-free)

Heating method

Hot air circulation or infrared heating (modular design optional)

4.Tin furnace system

Tin furnace capacity

400-500kg (refer to 500kg of GSD-WD350CE and 430kg of TB980C)

Crest type

Double wave crest (turbulence + advection wave), height 0-16mm adjustable

Temperature control accuracy

±1-2℃ (external PID heating, rapid heating and anti-riot tin)

Materials and maintenance

Titanium alloy furnace (corrosion resistant, suitable for lead-free solder)

Automatic dregs design (reduce manual cleaning frequency)

5. Control system

Operating interface

Industrial computer + touch screen (Windows system, support English/Chinese switching)

Intelligent function

Temperature curve storage/call, fault self-diagnosis, automatic switch

Production counting and logging (optional external printing function)

6. Other functions

Spray system

Constant pressure flux spraying (Taiwan lacquertreasure nozzle, uniform atomization)

Automatic spray width adjustment (for different PCB sizes)

Cooling system

Forced air cooling (outlet temperature ≤10℃, rapid cooling to reduce thermal stress)

Safety design

Overload protection, emergency stop button, liquid level alarm, etc