Key Features of PARMI SPI HS60 and Related Models
1. Advanced Inspection Technology:
3D Laser Triangulation Sensor: Provides robust 3D data and profiles the real shape of features, offering high accuracy against variations in materials and surface conditions.
Dual Laser Projection: Eliminates shadow effects, allowing for precise measurement of components, even those with significant height differences.
2. Real-Time Warpage Tracking:
Accurately measures PCB warpage up to ±5mm using real-time Z-axis control and scanning.
3. Component Inspection:
Can inspect components up to 65mm in height using a multi-step scanning method, providing industry-leading height measurement capabilities.
4. User Interface and Control:
Features a user-friendly interface with graphical windows for easy operation and setup.
Supports remote management of multiple SPI systems, reducing manpower needs while maintaining consistent quality.
5. Inspection Speed and Resolution:
Models like the HS60 Supreme offer inspection speeds of 100cm²/sec at resolutions of 13x13μm. However, specific speeds for the HS60XXL are not detailed.
6. Material Compatibility:
PARMI's inspection technology is compatible with various materials and surface conditions, unaffected by color or material variations.