MagicRay 3D SPI-VSP3000 series are suitable for 3D solder paste inspection after SMT screen printing.
Product Features
1.Intelligent zero reference point technology ensure accurate height measurement. 2.Effective at detecting solder bridging,solder breakage,icicle,etc.
3.Effective in detecting PCB with different color variations.
4.Automatic compensation for solder pad improves the accuracy of both solder paste heightand volume measurement.
5.SPC data analysis helps to improve process quality.
6.Three Point Checks software helps toquickly detectthe root cause of excess, lack of solder paste andsmearing.