ETON SMT placemant machine With 90000CPH for led DOB making chip mounter
Machine introduction
HT-E8D is a dual system,dual module multifunctional mounter to produce two different products at the same time,it can mount the component range from 0402 to 15mm.and e8d has two guide rail, and each rail can produce a product,and the one side is wrong,the other side will continue.E8D-1200 is suitable for the largest PCB board size of 1200 * 300mm,mini size 100*100mm.with a production capacity of 90000 CPH. for the E8 series model,we can provide customized service ,according to your size of your PCB size make the proper machine for your products. in order to service our customers better.
HT-E8D of Technical Parameter
Dimension | 3150*2250*1650mm |
PCB Size | Max: 1200*300mm Min: 100*100mm |
PCB Thickness | 0.5~5mm |
Mounting mode | Group picking and separately placing,separately picking and separately placing |
Mounting precision | ±0.04mm |
Mounting height | <15mm (Automatic changing) |
Mounting speed | 90000 CPH |
No.of camera | 4 sets Vision for the flight identification, Mark correction |
Components space | 0.2mm |
No.of feeders station | 48 PCS |
No.of head | 24 PCS |
SMT Line
The surface mount assembly process mainly includes the following steps: solder paste printing, component mount, and reflow soldering. The steps are summarized as follows:
Stencil Printing: solder paste is a follow-up material for the surface adhesive components and PCB to connect with each other. First, the steel plate is etched or laser cut, and then the solder paste is printed on the welding pad of PCB by the squeegee of the Printing machine, so as to enter the next step.
Component Placement: Component Placement is the key technology and work focus of the entire SMT process. The process USES highly precise automatic mounting equipment to accurately place the surface mount components on the solder pad of the printed PCB through computer programming.As the design of surface adhesive components is becoming more and more precise, the distance between the joints is becoming smaller, so the technical level difficulty of placement operation is increasing day by day.
Reflow Soldering,(Reflow Soldering) : Reflow Soldering is to have been placed on the surface of adhesive components of the PCB, after Reflow furnace first preheating with activated flux, to raise its temperature to 217 ℃ melt solder paste, feet and PCB Soldering pad connected components, then after cooling, cooling, make the solder curing, surface adhesive components and PCB bonding is completed.
Shipping and Delivery
Land transportation: suitable for inland countries and it is affordable;
Air freight: for urgent good, and it is the most expensive transportation way;
Shipping: It’s suitable for heavy goods, and the convenience and lower cost of shipping which is easy for clients to accept the arrival time of the goods.
Exhibition
ETON has participated in many exhibitions of foreign countries , such as India Mumbai Exhibition, India Delhi Exhibition, Egypt Exhibition, Turkey Exhibition, Pakistan Exhibition, etc and trading with more than 20 countries. Furthermore, we have took part in our domestic large exhibition, like Guangzhou Guangya Exhibition, Shanghai Munich Exhibition, Chongqing LED light Exhibition, etc.
FAQ
Q: Do you have a product certification certificate?
A: Our products have CCC, CE, SRIA certification.
Q: What is your payment terms?
A:100% payment before delivery or 50% deposit in advance and the rest before shipment.
Contact David
Whatsapp/Wechat/Tel: +86 13827425982
E-mail: david@eton-mounter.com